Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione3.664 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione6.752 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.624 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione5.456 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione2.400 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione6.448 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.336 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione15.360 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.672 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione76.824 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.824 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.784 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 256KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.728 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 256KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.080 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 256KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.920 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.072 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC EEPROM 64KBIT 5MHZ M2J
|
pacchetto: M2 J, Smart Card Module (TWI) |
Azione3.296 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.600 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.480 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC SRAM 256KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione222.264 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.464 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.280 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.888 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.280 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.872 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.272 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |