Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 4MBIT 40MHZ 8WDFN
|
pacchetto: - |
Azione3.360 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 2MBIT 40MHZ 8CSP
|
pacchetto: 8-UFBGA, CSPBGA |
Azione3.792 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 40MHz | 3.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.784 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione8.520 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.416 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione14.844 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.904 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.520 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.304 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.824 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.432 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione14.700 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.520 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.088 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 2MBIT 40MHZ 8TDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.248 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 40MHz | 3.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione21.804 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.344 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.488 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.104 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 5MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.848 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione6.224 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.584 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8VFBGA
|
pacchetto: - |
Azione6.032 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.984 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC FLASH 2MBIT 20MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione76.308 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |