Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Channel Type | Number of Circuits | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | Input Signal | Output Signal | Output Type | Data Rate | Operating Temperature | Features | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC XLATOR TTL-DIFF PECL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione284.172 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR 3.3V DIFF 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
Unidirectional | 1 | 1 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR DUAL 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.992 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR LVPECL-LVTTL DFF 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.312 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SIM CARD LEVEL SHIFTER 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione7.184 |
|
Bidirectional | 1 | 1 | 1.6V ~ 5.5V | 2.7V ~ 5.5V | - | - | Open Drain | - | -40°C ~ 125°C (TJ) | SIM Card Interface | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC TRANSLATOR DIFF 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione34.728 |
|
Unidirectional | 1 | 1 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR DIFF 3.3V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione7.856 |
|
Unidirectional | 1 | 2 | - | - | LVPECL, LVTTL | LVTTL, LVPECL | Differential, Single-Ended | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC TRANSLATOR DUAL 5.0V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
Unidirectional | 1 | 2 | - | - | PECL | TTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR PECL TTL DFF 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione15.948 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR DUAL LV PECL-TTL 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.952 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR PECL-TTL DIFF 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione287.568 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR 3.3V DIFF 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione16.488 |
|
Unidirectional | 1 | 1 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR PECL TTL DFF 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione275.040 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR PECL TTL DFF 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione51.216 |
|
Unidirectional | 1 | 2 | - | - | PECL | TTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR PECL DUAL 3.3V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione5.376 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC TRANSLATOR DUAL 3.3/5V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione5.760 |
|
Unidirectional | 1 | 2 | - | - | LVCMOS, LVTTL | LVPECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC TRANSLATOR DUAL 3.3V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione2.416 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC XLATOR ANY IN-LVPECL DFF 8MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione4.816 |
|
Unidirectional | 1 | 1 | - | - | CML, CMOS, HSTL, LVDS, TTL | LVPECL | Differential | 2.5Gbps | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC TRANSLATOR 3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione8.640 |
|
Unidirectional | 1 | 2 | - | - | LVPECL, LVTTL | LVTTL, LVPECL | Differential, Single-Ended | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC TRANSLATOR DIFF 3.3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione45.012 |
|
Unidirectional | 1 | 2 | - | - | LVCMOS, LVTTL | LVPECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC TRANSLATOR DIFF 3.3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.000 |
|
Unidirectional | 1 | 1 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC TRANSLATOR LVPECL-LVTTL 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione21.018 |
|
Unidirectional | 1 | 1 | - | - | CML, LVDS, LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC XLATOR TTL/CMOS-PECL LV 8MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione16.086 |
|
Unidirectional | 1 | 1 | - | - | LVCMOS, LVTTL | LVPECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC TRANSLATOR DUAL LVDS 10MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione40.896 |
|
Unidirectional | 1 | 2 | - | - | CML, PECL, LVPECL | LVDS | Differential | 1.5Gbps | -40°C ~ 85°C (TA) | - | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
IC TRANSLATOR DUAL LVPECL 10MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione26.640 |
|
Unidirectional | 1 | 2 | - | - | CML, CMOS, HSTL, LVDS, TTL | LVPECL | Differential | 2.5Gbps | -40°C ~ 85°C (TA) | - | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
USB84604AFT-B-001080RV02
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
USX4702T-I/RSXV05
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
USB84602AFT-B-001080RV03
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |