Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Output Type | Voltage - Supply, Single/Dual (±) | Voltage - Input Offset (Max) | Current - Input Bias (Max) | Current - Output (Typ) | Current - Quiescent (Max) | CMRR, PSRR (Typ) | Propagation Delay (Max) | Hysteresis | Operating Temperature | Package / Case | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMP 1.6V QUAD O-D 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione28.308 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione3.616 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
||
Microchip Technology |
IC COMP 1.6V QUAD P-P 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione4.416 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
||
Microchip Technology |
IC COMP 1.6V QUAD P-P 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione4.384 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V QUAD14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione24.600 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
||
Microchip Technology |
IC COMP PP I/O QUAD 1.6V 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione3.632 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
||
Microchip Technology |
IC COMP PP I/O QUAD 1.6V 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione35.268 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V QUAD 14-DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione5.440 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione2.384 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione5.568 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
||
Microchip Technology |
IC COMP DUAL 1.8V OD 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.000 |
|
2 | CMOS, Open-Drain | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP DUAL 1.8V OD 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.976 |
|
2 | CMOS, Open-Drain | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP DUAL 1.8V PP 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
pacchetto: 4-UFDFN Exposed Pad |
Azione4.688 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
pacchetto: 4-UFDFN Exposed Pad |
Azione3.184 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
pacchetto: 4-UFDFN Exposed Pad |
Azione2.784 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
pacchetto: 4-UFDFN Exposed Pad |
Azione4.624 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
pacchetto: 4-UFDFN Exposed Pad |
Azione6.272 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
pacchetto: 4-UFDFN Exposed Pad |
Azione5.184 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.228 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.392 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
pacchetto: 6-UFDFN Exposed Pad |
Azione7.984 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
pacchetto: 6-UFDFN Exposed Pad |
Azione6.704 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
pacchetto: 6-UFDFN Exposed Pad |
Azione2.096 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6TDFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione3.920 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.512 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.504 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |