Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Output Type | Voltage - Supply, Single/Dual (±) | Voltage - Input Offset (Max) | Current - Input Bias (Max) | Current - Output (Typ) | Current - Quiescent (Max) | CMRR, PSRR (Typ) | Propagation Delay (Max) | Hysteresis | Operating Temperature | Package / Case | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMP 1.6V DUAL P-P 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.920 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.944 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL P-P 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.272 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.320 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione29.580 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione200.328 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.436 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.136 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione32.904 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione235.908 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP SNGL W/REF SC70-5
|
pacchetto: 5-TSSOP, SC-70-5, SOT-353 |
Azione6.192 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
||
Microchip Technology |
IC COMP 1.6V SGL P-P W/CS 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.496 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.384 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione19.188 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.944 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.072 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.700 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.304 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.352 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.392 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.872 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.840 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.640 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.132 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione31.272 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.088 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |