Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
pacchetto: - |
Azione3.344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER
|
pacchetto: - |
Azione5.440 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH QDX QUAD 144LBGA
|
pacchetto: 144-LBGA |
Azione5.088 |
|
- | 4 | 3V ~ 3.6V | 64mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC ENHANCED DIGITAL SWITCH
|
pacchetto: - |
Azione3.712 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.320 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.920 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.144 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.528 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
pacchetto: 324-BGA |
Azione4.192 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
pacchetto: 324-BGA |
Azione4.576 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
pacchetto: 324-BGA |
Azione3.536 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
pacchetto: 36-BSOP (0.295", 7.50mm Width) |
Azione5.760 |
|
Serial | 1 | 2.7V ~ 3.6V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
pacchetto: 365-BBGA |
Azione6.208 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
pacchetto: 365-BBGA |
Azione2.368 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.768 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.840 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.280 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC CODEC MFC 5V 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.480 |
|
SSI | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CODEC MFC 5V 20SOIC
|
pacchetto: 20-SOIC (0.209", 5.30mm Width) |
Azione4.864 |
|
- | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.800 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC SLIC 1CH UNIV 10V 28PLCC
|
pacchetto: - |
Azione2.208 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC OLAC CHIPSET 1CHAN 48LQFP
|
pacchetto: - |
Azione2.304 |
|
- | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.248 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 48TQFP
|
pacchetto: - |
Azione5.600 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione3.904 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione5.456 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.192 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione3.888 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |