Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SLIC 1CH UNIV 145V 28QFN
|
pacchetto: - |
Azione4.224 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT 1CH FXS 8KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione2.832 |
|
PCM | 1 | - | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 64TQFP
|
pacchetto: - |
Azione4.576 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 64-eTQFP |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
pacchetto: - |
Azione5.616 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
pacchetto: - |
Azione3.360 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
pacchetto: - |
Azione2.592 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
pacchetto: - |
Azione5.104 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
pacchetto: - |
Azione3.632 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
pacchetto: - |
Azione6.176 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH 48LQFP
|
pacchetto: - |
Azione2.064 |
|
4-Wire Serial | 2 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH 48LQFP
|
pacchetto: - |
Azione5.472 |
|
4-Wire Serial | 2 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC SLAC 1FXS 1CH HV 48LQFP
|
pacchetto: - |
Azione2.032 |
|
- | 1 | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLAC 1FXS 1CH HV 48LQFP
|
pacchetto: - |
Azione7.648 |
|
- | 1 | - | - | - | - | - | - | - |
||
Microchip Technology |
IC OLAC CHIPSET 1CHAN 48LQFP
|
pacchetto: - |
Azione7.392 |
|
- | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC VOICEPORT 2CH SLAC ZSI 48QFN
|
pacchetto: - |
Azione7.568 |
|
4-Wire Serial | 2 | 3.3V ~ 35V | - | - | - | Surface Mount | - | 48-QFN |
||
Microchip Technology |
IC VOICEPORT 2CH SLAC ZSI 48QFN
|
pacchetto: - |
Azione5.360 |
|
4-Wire Serial | 2 | 3.3V ~ 35V | - | - | - | Surface Mount | - | 48-QFN |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA
|
pacchetto: 324-BGA |
Azione4.304 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DIGITAL SWITCH 12K CH 272BGA
|
pacchetto: 272-BBGA |
Azione7.616 |
|
- | - | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione5.712 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC DIGITAL SWITCH 32K CH 484BGA
|
pacchetto: 484-BGA |
Azione2.640 |
|
- | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.816 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256BGA
|
pacchetto: 256-BGA |
Azione3.744 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione6.336 |
|
- | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
pacchetto: 208-LBGA |
Azione2.064 |
|
LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC ECHO CANCEL DUAL CODEC 81CBGA
|
pacchetto: 81-LBGA |
Azione2.752 |
|
Serial | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 81-LBGA | 81-CABGA (10x10) |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
pacchetto: 552-BGA |
Azione6.528 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC CESOP PROC 1024CH 552BGA
|
pacchetto: 552-BGA |
Azione2.448 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC CESOP PROCESSOR 256CH 552BGA
|
pacchetto: 552-BGA |
Azione3.808 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |