Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione6.160 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione3.232 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione6.704 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione3.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.8GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione7.536 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione7.760 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione6.800 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione6.816 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione6.736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione2.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione25.200 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione7.296 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione60.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione44.400 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione18.000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione63.600 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione108.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione84.000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione19.644 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione15.552 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 12-WFDFN Exposed Pad |
Azione4.976 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 12-WFDFN Exposed Pad |
Azione7.792 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 12-WFDFN Exposed Pad |
Azione5.264 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 12-WFDFN Exposed Pad |
Azione5.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione7.280 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione4.320 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione7.088 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione5.952 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |