Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Main Purpose | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione7.504 |
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- | - | - | - | - | - | - | - | - | - | - | - |
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IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione3.296 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione5.392 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione5.264 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione3.584 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.792 |
|
PCI Express (PCIe) | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 1 | 1:2 | Yes/Yes | 160MHz | 3.135V ~ 3.465V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: - |
Azione4.272 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione5.968 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 4:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP-EP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione3.936 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 4:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP-EP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-LQFP |
Azione5.104 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 2:4 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-LQFP |
Azione2.100 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 3:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-TQFP Exposed Pad |
Azione3.248 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 3:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 56-VFQFN Exposed Pad |
Azione3.120 |
|
Ethernet, PCI Express (PCIe) | HCSL, LVDS, LVHSTL, LVPECL, M-LVDS | LVDS, LVPECL | 1 | 1:8 | Yes/Yes | 165MHz | 3.3V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.776 |
|
PCI Express (PCIe) | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 1 | 1:2 | Yes/Yes | 160MHz | 3.135V ~ 3.465V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione4.880 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 4:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP-EP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione3.184 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 4:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP-EP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-LQFP |
Azione7.312 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 2:4 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-LQFP |
Azione4.368 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 3:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.616 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 3:2 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DIFF PCIE 72VFQFPN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione7.232 |
|
Intel QPI, PCI Express (PCIe) | Clock | HCSL | - | 1:19 | Yes/Yes | 400MHz | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-VFQFPN (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione4.192 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 6:6 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 100-LQFP Exposed Pad |
Azione7.296 |
|
Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | CMOS, LVDS, PECL | 1 | 6:6 | Yes/Yes | 622.08MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
CLOCK BUFFER 3.3V 48VFQFPN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.256 |
|
PCI Express (PCIe) | HCSL | HCSL | 1 | 1:8 | Yes/Yes | 200MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER HCSL 64VFQFPN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione8.676 |
|
Intel QPI, PCI Express (PCIe) | Clock | HCSL | 1 | 1:12 | Yes/Yes | 400MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DIFF PCIE 72VFQFPN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione16.680 |
|
Intel QPI, PCI Express (PCIe) | Clock | HCSL | 1 | 1:19 | Yes/Yes | 400MHz | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-VFQFPN (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK FANOUT/BUFF ZD 48VFQFPN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione24.510 |
|
PCI Express (PCIe) | HCSL | HCSL | 1 | 1:8 | Yes/Yes | 200MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |