Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH MEM 6G LPDDR2 MLC
|
pacchetto: - |
Azione3.200 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH MEM 6G LPDDR2 MLC
|
pacchetto: - |
Azione5.328 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione3.248 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -40°C ~ 105°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione7.360 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -40°C ~ 105°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione5.088 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -40°C ~ 105°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione3.216 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -40°C ~ 105°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
MODULE EMMC 64GB 153TFBGA
|
pacchetto: - |
Azione3.136 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
MODULE EMMC 64GB 153TFBGA
|
pacchetto: - |
Azione2.000 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH MEM 536G MCP
|
pacchetto: - |
Azione5.104 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH MEM 536G MCP
|
pacchetto: - |
Azione3.440 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione7.936 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -40°C ~ 95°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione2.304 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -40°C ~ 95°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione2.496 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -40°C ~ 95°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione5.376 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -40°C ~ 95°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH 256G MMC 169TFBGA
|
pacchetto: 169-TFBGA |
Azione3.392 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 169-TFBGA | 169-TFBGA (14x18) |
||
Micron Technology Inc. |
IC FLASH 1T PARALLEL 132VBGA
|
pacchetto: - |
Azione4.944 |
|
FLASH | FLASH - NAND | 1Tb (128G x 8) | Parallel | 333MHz | - | - | 2.5V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH 1T PARALLEL 132VBGA
|
pacchetto: - |
Azione2.256 |
|
FLASH | FLASH - NAND | 1Tb (128G x 8) | Parallel | 333MHz | - | - | 2.5V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR3 32G FBGA
|
pacchetto: 178-VFBGA |
Azione4.768 |
|
DRAM | SDRAM - Mobile LPDDR3 | 32Gb (1G x 32) | - | 1.066GHz | - | - | 1.2V | -30°C ~ 85°C (TC) | Surface Mount | 178-VFBGA | 178-FBGA (12x11.5) |
||
Micron Technology Inc. |
MODULE EMMC 32GB
|
pacchetto: 169-TFBGA |
Azione6.880 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 169-TFBGA | 169-TFBGA (14x18) |
||
Micron Technology Inc. |
MODULE EMMC 32GB
|
pacchetto: 100-LBGA |
Azione2.048 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LBGA | 100-LBGA (14x18) |
||
Micron Technology Inc. |
IC SDRAM DDR4 MULTICHIP
|
pacchetto: 96-TFBGA |
Azione7.376 |
|
DRAM | SDRAM - DDR4 | 16Gb (1G x 16) | Parallel | 1.6GHz | 15ns | 19ns | 1.14V ~ 1.26V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13.5) |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione4.400 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione7.936 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione5.536 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione7.008 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione4.368 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione7.232 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 1T PARALLEL 132VBGA
|
pacchetto: - |
Azione4.048 |
|
FLASH | FLASH - NAND | 1Tb (128G x 8) | Parallel | 333MHz | - | - | 2.5V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | - | - |