Prodotti Microchip Technology

DSC1001DC1-066.6600

Microchip Technology

OSC MEMS 66.66MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 66.66MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: 0°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

DSC1122CI5-074.0000T

Microchip Technology

OSC MEMS 74.000MHZ LVPECL SMD

• Type: MEMS (Silicon)
• Frequency: 74MHz
• Function: Enable/Disable
• Output: LVPECL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 58mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 6-SMD, No Lead

DSC1001BI2-060.0000T

Microchip Technology

OSC MEMS 60.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 60MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

DSC1123DI2-106.2500

Microchip Technology

OSC MEMS 106.2500MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 106.25MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 6-SMD, No Lead

MTD6508-E/NA

Microchip Technology

IC MOTOR DRIVER PAR 10UDFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (3)
• Interface: PWM
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 1A
• Voltage - Supply: 2 V ~ 5.5 V
• Voltage - Load: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-UFDFN Exposed Pad
• Supplier Device Package: 10-UDFN (3x3)

pacchetto: 10-UFDFN Exposed Pad

MIC2596-1BTS-TR

Microchip Technology

IC SWITCH HOT SWAP DUAL 20-TSSOP

• Type: Hot Swap Controller
• Number of Channels: 2
• Internal Switch(s): Yes
• Applications: -48V
• Features: Auto Retry, Thermal Limit, UVLO
• Programmable Features: Circuit Breaker, Fault Timeout
• Voltage - Supply: -70 V ~ -15 V
• Current - Output (Max): -
• Operating Temperature: -40°C ~ 85°C
• Current - Supply: 3.3mA
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

MCP73833-NVI/MF

Microchip Technology

IC LI-ION/LI-POLY CTRLR 10DFN

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 1
• Current - Charging: Constant - Programmable
• Programmable Features: Current
• Fault Protection: Over Temperature
• Charge Current - Max: 1.1A
• Battery Pack Voltage: 4.35V
• Voltage - Supply (Max): 6V
• Interface: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

pacchetto: 10-VFDFN Exposed Pad

SY100EPT22VKI-TR

Microchip Technology

IC TRANSLATOR DIFF 3.3V 8-MSOP

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVCMOS, LVTTL
• Output Signal: LVPECL
• Output Type: Differential
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

DSPIC33FJ128MC510-I/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 100TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

pacchetto: 100-TQFP

PIC32MX350F256L-V/TL

Microchip Technology

IC MCU 32BIT 256KB FLASH 124VTLA

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 124-VFTLA Dual Row Exposed Pad
• Supplier Device Package: 124-VTLA (9x9)

pacchetto: 124-VFTLA Dual Row Exposed Pad

PIC24FJ128GB406T-I/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, PMP/PSP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b/12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

pacchetto: 64-TQFP

PIC12F1612-E/SN

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 8SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 6
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

pacchetto: 8-SOIC (0.154", 3.90mm Width)

PIC12F508-E/P

Microchip Technology

IC MCU 8BIT 768B FLASH 8DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 5
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

pacchetto: 8-DIP (0.300", 7.62mm)

PIC32MX470F512L-I/PF

Microchip Technology

IC MCU 32BIT 512KB FLASH 100TQFP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 81
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

pacchetto: 100-TQFP

ATSAM3A4CA-AU

Microchip Technology

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 84MHz
• Connectivity: CAN, I2C, IrDA, LIN, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 63
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacchetto: 100-LQFP

PIC18LF26J53-I/ML

Microchip Technology

IC MCU 8BIT 64KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 2.75 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

pacchetto: 28-VQFN Exposed Pad

PIC18F24J50-I/ML

Microchip Technology

IC MCU 8BIT 16KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

pacchetto: 28-VQFN Exposed Pad

ATREB215-XPRO-A

Microchip Technology

RF215 EXTENSIONBRD(800/900MHZ&2)

• Type: Transceiver; 802.15.4
• Frequency: -
• For Use With/Related Products: AT86RF215
• Supplied Contents: Board

pacchetto: -

LE89830JSCT

Microchip Technology

IC SLIC 1CH 8KHZ 150V HV 16SOIC

• Function: -
• Interface: PCM
• Number of Circuits: 1
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 16-SOIC

pacchetto: -

JANS1N6873UTK2AS

Microchip Technology

DIODE GEN PURP 400MA THINKEY2

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): 400mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 400 mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: ThinKey™2
• Supplier Device Package: ThinKey™2
• Operating Temperature - Junction: -65°C ~ 175°C

pacchetto: -

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CDLL5274D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 130 V
• Tolerance: ±20%
• Power - Max: -
• Impedance (Max) (Zzt): 1100 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 94 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 200°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

pacchetto: -

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DSC2311KI2-R0065T

Microchip Technology

IC CLOCK GENERATOR 6DFN

• Type: Clock Generator
• PLL: Yes
• Input: -
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: No/No
• Frequency - Max: 40MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.25V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-VDFN
• Supplier Device Package: 6-DFN (2.5x2)

pacchetto: -

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JANTXV1N3826D-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.1 V
• Tolerance: ±1%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 7 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

pacchetto: -

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PIC24FJ128GL408-E-PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 80TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
• Data Converters: A/D 24x10/12b; D/A 1x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

pacchetto: -

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JANTX1N5807US-TR

Microchip Technology

DIODE GEN PURP 50V 3A B SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30 ns
• Current - Reverse Leakage @ Vr: 5 µA @ 50 V
• Capacitance @ Vr, F: 60pF @ 10V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 175°C

pacchetto: -

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JANTXV1N4991D

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 240 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 650 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 25.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

pacchetto: -

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JANTX2N3762U4

Microchip Technology

TRANS PNP 40V 1.5A U4

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1.5 A
• Voltage - Collector Emitter Breakdown (Max): 40 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: U4

pacchetto: -

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JANS1N4481C

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 47 V
• Tolerance: ±2%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41

pacchetto: -

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