Prodotti Microchip Technology

MIC5210-2.8YMM

Microchip Technology

IC REG LINEAR 2.8/2.8V 8MSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 16V
• Voltage - Output (Min/Fixed): 2.8V, 2.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.35V @ 150mA, 0.35V @ 150mA
• Current - Output: 150mA, 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 150µA ~ 2.5mA
• PSRR: 75dB (100Hz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MIC809LU-TR

Microchip Technology

IC RESET GEN 4.63V VTH SOT23-3

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 4.63V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

pacchetto: TO-236-3, SC-59, SOT-23-3

SST38VF6403B-70-5I-EKE

Microchip Technology

IC FLASH 64MBIT 70NS 48TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 64Mb (4M x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10µs
• Access Time: 70ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 48-TSOP

pacchetto: 48-TFSOP (0.724", 18.40mm Width)

SST25WF040-40-5I-QAE-T

Microchip Technology

IC FLASH 4MBIT 40MHZ 8WSON

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (512K x 8)
• Memory Interface: SPI
• Clock Frequency: 40MHz
• Write Cycle Time - Word, Page: 60µs
• Access Time: -
• Voltage - Supply: 1.65 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-WDFN Exposed Pad
• Supplier Device Package: 8-WSON

pacchetto: 8-WDFN Exposed Pad

93C46C-E/MS

Microchip Technology

IC EEPROM 1KBIT 3MHZ 8MSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8, 64 x 16)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 2ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

KSZ8001S-TR

Microchip Technology

IC TXRX ETHERNET 48SSOP

• Type: Transceiver
• Protocol: MII, RMII, SMII
• Number of Drivers/Receivers: -
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 48-SSOP

pacchetto: 48-BSSOP (0.295", 7.50mm Width)

USB5926T/KD

Microchip Technology

IC HUB CONTROLLER USB 100VQFN

• Protocol: USB
• Function: Hub Controller
• Interface: I2C, SPI
• Standards: USB 3.1
• Voltage - Supply: 1.2V, 3.3V
• Current - Supply: -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-VFQFN Exposed Pad
• Supplier Device Package: 100-VQFN (12x12)

pacchetto: 100-VFQFN Exposed Pad

AT91SAM9XE128-CU

Microchip Technology

IC MCU 32BIT 128KB FLASH 217BGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 40K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 217-LFBGA
• Supplier Device Package: 217-BGA (15x15)

pacchetto: 217-LFBGA

ATMEGA162L-8PI

Microchip Technology

IC MCU 8BIT 16KB FLASH 40DIP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

pacchetto: 40-DIP (0.600", 15.24mm)

ATMEGA128-16MI

Microchip Technology

IC MCU 8BIT 128KB FLASH 64QFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

pacchetto: 64-VFQFN Exposed Pad

PIC24HJ128GP310-I/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 100TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

pacchetto: 100-TQFP

DSPIC33FJ32GP304-E/ML

Microchip Technology

IC MCU 16BIT 32KB FLASH 44QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DCI, DMA, I2S, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

pacchetto: 44-VQFN Exposed Pad

PIC18F46J13T-I/ML

Microchip Technology

IC MCU 8BIT 64KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

pacchetto: 44-VQFN Exposed Pad

PIC16C58B-04I/SO

Microchip Technology

IC MCU 8BIT 3KB OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 73 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

pacchetto: 18-SOIC (0.295", 7.50mm Width)

MCP4641T-103E/ST

Microchip Technology

IC POT DGTL 10K DUAL 14-TSSOP

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 2
• Number of Taps: 129
• Resistance (Ohms): 10k
• Interface: I2C
• Memory Type: Non-Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V
• Features: Selectable Address
• Tolerance: ±20%
• Temperature Coefficient (Typ): 150 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 75
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

pacchetto: 14-TSSOP (0.173", 4.40mm Width)

ATSAMR21G17A-MU

Microchip Technology

IC RF TXRX+MCU ISM>1GHZ 48-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: General ISM > 1GHZ
• Protocol: -
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 4dBm
• Sensitivity: -99dBm
• Memory Size: 128kB Flash, 16kB SRAM
• Serial Interfaces: I2C, SPI, UART, USART, USB
• GPIO: 28
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 11.3mA ~ 11.8mA
• Current - Transmitting: 7.2mA ~ 13.8mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VFQFN Exposed Pad

pacchetto: 48-VFQFN Exposed Pad

RN174C-I/RM

Microchip Technology

MODULE GSX BOARD FOR RN-171

• Type: Transceiver; 802.11 b/g (Wi-Fi, WiFi, WLAN)
• Frequency: 2.4GHz
• For Use With/Related Products: RN-171
• Supplied Contents: Board

pacchetto: -

CDLL4689-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.1 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

pacchetto: -

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JANS1N6343CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 62 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 125 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 47 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

pacchetto: -

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ATA6564-GAQW0-VAO

Microchip Technology

IC TRANSCEIVER HALF 1/1 8SOIC

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

pacchetto: -

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CDLL5235B-TR

Microchip Technology

DIODE ZENER 6.8V DO-213AB

• Voltage - Zener (Nom) (Vz): 6.8 V
• Tolerance: ±5%
• Power - Max: -
• Impedance (Max) (Zzt): 5 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

pacchetto: -

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JANKCCD2N5153

Microchip Technology

RH POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 2 A
• Voltage - Collector Emitter Breakdown (Max): 80 V
• Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
• Current - Collector Cutoff (Max): 50µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 2.5A, 5V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AD, TO-39-3 Metal Can
• Supplier Device Package: TO-39 (TO-205AD)

pacchetto: -

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AVR64DD28-I-SS

Microchip Technology

IC MCU 8BIT 64KB FLASH 28SSOP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 19x12b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

pacchetto: -

1N5247BUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 17 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 19 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 13 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

pacchetto: -

PIC16F13144-I-SS

Microchip Technology

7KB FLASH, 512B RAM, 10B ADC, 8B

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (7K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 22x10b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

pacchetto: -

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CDLL4775A-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 8.5 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 6 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

pacchetto: -

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2N5874

Microchip Technology

PNP POWER TRANSISTOR SILICON AMP

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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KV1923A-150C

Microchip Technology

SI TVAR NON HERMETIC EPSM SMT

• Capacitance @ Vr, F: 3.2pF @ 8V, 1MHz
• Capacitance Ratio: -
• Capacitance Ratio Condition: -
• Voltage - Peak Reverse (Max): 12 V
• Diode Type: Single
• Q @ Vr, F: 600 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

pacchetto: -

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