Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX DTMF 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.344 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC TXRX DTMF 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.560 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.216 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione4.960 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.584 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione3.536 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione3.664 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Microchip Technology |
IC SLIC 1CH 63DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.832 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLIC 1CH 63DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.944 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC TXRX DTMF 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.240 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione5.408 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.456 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione5.984 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
pacchetto: 64-QFN |
Azione5.312 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 64-QFN | 64-QFN |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.536 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione4.448 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
pacchetto: 64-QFN |
Azione6.704 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 64-QFN | 64-QFN |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.320 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.960 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.512 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.848 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.048 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC TXRX DTMF 24SSOP
|
pacchetto: - |
Azione4.784 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Microchip Technology |
IC SLIC 2CH 50DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione4.672 |
|
- | 2 | 4.75V ~ 5.25V | 9mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microchip Technology |
IC SLIC 2CH 50DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione7.536 |
|
- | 2 | 4.75V ~ 5.25V | 9mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.472 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.296 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.008 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |