Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
Freedm3366A1024LE, High Density
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TSI SWITCH 613FCBGA
|
pacchetto: - |
Request a Quote |
|
Serial | 1 | - | - | 8 W | - | Surface Mount | 613-BGA, FCBGA | 613-FCBGA (33x33) |
||
Microchip Technology |
128G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione378 |
|
Ethernet | 57 | - | - | - | - | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Microchip Technology |
IC TXRX SERIAL 10GE/10GFC FCCBGA
|
pacchetto: - |
Request a Quote |
|
I2C, SPI | 1 | 1.8V | - | 1.15 W | -5°C ~ 90°C | Surface Mount | 244-BGA, FCBGA | 244-FCBGA (17x17) |
||
Microchip Technology |
10GBASEKR_PHY-OM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PM8620 - 20G Narrowband Switch E
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
3-PORT 10/100 SWITCH W/ 1X RMII
|
pacchetto: - |
Request a Quote |
|
I2C, RMII, SPI | 2 | 3.135V ~ 3.465V | 114mA | - | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microchip Technology |
POWER LINE COMMUNICATION MODEM,
|
pacchetto: - |
Request a Quote |
|
SPI | 1 | 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V | - | - | -40°C ~ 85°C | Surface Mount | 81-TBGA | 81-TFBGA (10x10) |
||
Microchip Technology |
160G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione60 |
|
Ethernet | 57 | - | - | - | - | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Microchip Technology |
Freedm84A1024L, High Density HDL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE BITS TRANSCEIVER AND CC R
|
pacchetto: - |
Azione810 |
|
E1 | 1 | 1.62V ~ 1.98V | 152mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
XDSL CPE LINE DRIVER
|
pacchetto: - |
Azione13.890 |
|
- | 1 | 12.6V ~ 15.4V | 26.1mA | 1.37 W | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
S/UNI-8x155 SATURN User Network
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HDLIU# 32
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SPECTRA 4X155 SONET/SDH Payload
|
pacchetto: - |
Request a Quote |
|
Bus | 1 | 3.14V ~ 3.47V | 860mA | - | -40°C ~ 85°C | Surface Mount | 520-LBGA Exposed Pad | 520-SBGA (40x40) |
||
Microchip Technology |
11 PORT MANAGED SGMII ENTERPRISE
|
pacchetto: - |
Request a Quote |
|
SPI, UART, 2-Wire | 11 | - | - | 1.6 W | -40°C ~ 125°C | Surface Mount | 284-QFP | 284-TQFP (24x24) |
||
Microchip Technology |
160G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione120 |
|
SPI | - | - | - | - | 0°C ~ 105°C | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Microchip Technology |
Freedm32A1024L, High Density HDL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
Octal E1/T1/J1 Low Latency Trans
|
pacchetto: - |
Request a Quote |
|
E1, J1, SPI, T1 | 8 | 1.71V ~ 1.89V, 3.135V ~ 3.465V | 916mA | 2.29 W | -40°C ~ 85°C | Surface Mount | 288-LBGA Exposed Pad | 288-TSBGA (23x23) |
||
Microchip Technology |
128G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione120 |
|
SPI | - | - | - | - | 0°C ~ 105°C | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Microchip Technology |
6 PORT CARRIER ETHERNET SWITCH
|
pacchetto: - |
Request a Quote |
|
SPI, UART, 2-Wire | 7 | - | - | 1.5 W | -40°C ~ 125°C | Surface Mount | 284-QFP | 284-TQFP (24x24) |
||
Microchip Technology |
S/UNI-TETRA SATURN User Network
|
pacchetto: - |
Request a Quote |
|
Serial | 1 | 2.97V ~ 3.63V | 770mA | - | -40°C ~ 85°C | Surface Mount | 304-LBGA Exposed Pad | 304-SBGA (31x31) |
||
Microchip Technology |
POWER LINE COMMUNICATION MODEM,
|
pacchetto: - |
Request a Quote |
|
SPI | 1 | 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V | - | - | -40°C ~ 85°C | Surface Mount | 81-TBGA | 81-TFBGA (10x10) |
||
Microchip Technology |
IC PHY DUAL MEDIA OCTAL HSBGA
|
pacchetto: - |
Request a Quote |
|
JTAG, SerDes, Serial | 8 | 1.14V ~ 1.26V, 3.13V ~ 3.47V | 1.488A | - | 0°C ~ 90°C | Surface Mount | 444-BGA Exposed Pad | 444-BGA (27x27) |
||
Microchip Technology |
PM5376H - TSE Nx160, 160Gbs, STS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
Freedm3366A1024L, High Density H
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TSI SWITCH 1072FCBGA
|
pacchetto: - |
Request a Quote |
|
Serial | 1 | 1.2V, 2.5V | - | 26 W | - | Surface Mount | 1072-BGA, FCBGA | 1072-FCBGA (45x45) |
||
Microchip Technology |
200G ENTERPRISE ETHERNET SWITCH
|
pacchetto: - |
Azione3 |
|
Ethernet | 57 | - | - | - | - | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |