Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC LIN TXRX ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.248 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC LIN TXRX ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.320 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.280 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.344 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC LIN TXRX ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.168 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC LIN TXRX ON-BOARD VREG 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.504 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.840 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.408 |
|
RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 10/100 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.752 |
|
RMII | 2/2 | Full | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 10/100 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.112 |
|
RMII | 2/2 | Full | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.264 |
|
Ethernet | 1/1 | - | - | - | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.984 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.312 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.208 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC TXRX LIN 5.0V LDO 8-DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.728 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.616 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.776 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 5.0V LDO 8-DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.584 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione12.060 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione20.652 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC TXRX USB HS ENG ULPI 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.048 |
|
USB 2.0 | 1/1 | - | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX 1.8V-3.3V ULPI 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.448 |
|
USB 2.0 | - | - | - | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX USB 2.0 ULPI 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.888 |
|
USB 2.0 | 1/1 | Half | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.304 |
|
Ethernet | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 24QFN
|
pacchetto: 24-VFQFN Exposed Pad, 24-MLF? |
Azione5.472 |
|
Ethernet | 1/1 | Full | - | - | 3.3V | 0°C ~ 70°C | Surface Mount | 24-VFQFN Exposed Pad, 24-MLF? | 24-QFN (4x4) |
||
Microchip Technology |
IC TXRX LIN ON-BOARD VREG 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione84.264 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN ON-BOARD VREG 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.208 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC LIN TXRX ON-BOARD VREG 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione69.720 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |