Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.136 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione17.172 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione2.100 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione2.624 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.696 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.824 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.232 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione4.736 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC USB TRANSCEIVER 14-MLF
|
pacchetto: 14-VFQFN Exposed Pad, 14-MLF? |
Azione5.792 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-VFQFN Exposed Pad, 14-MLF? | 14-MLF? (2.5x2.5) |
||
Microchip Technology |
IC USB TRANSCEIVER 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.448 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (4x4) |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione4.544 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione5.712 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC USB TRANSCEIVER 14-MLF
|
pacchetto: 14-VFQFN Exposed Pad, 14-MLF? |
Azione6.304 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-VFQFN Exposed Pad, 14-MLF? | 14-MLF? (2.5x2.5) |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.464 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.672 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.392 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.392 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.584 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.456 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.096 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.968 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.032 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.832 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione39.876 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.088 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.200 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN B/DIR 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.208 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.704 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |