Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Processor | Program Memory Type | Controller Series | RAM Size | Interface | Number of I/O | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione5.088 |
|
AVR | - | - | - | I2C | 4 | 3.3V | 0°C ~ 70°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione5.232 |
|
AVR | - | - | - | I2C | 4 | 3.3V | 0°C ~ 70°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione4.816 |
|
AVR | - | - | - | I2C | 4 | 3.3V | 0°C ~ 70°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione5.104 |
|
AVR | - | - | - | I2C | 4 | 3.3V | 0°C ~ 70°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione4.064 |
|
AVR | - | - | - | I2C | 4 | 3.3V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione2.672 |
|
AVR | - | - | - | I2C | 4 | 3.3V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione7.328 |
|
AVR | - | - | - | I2C | 4 | 3.3V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
MEM FF IND I2C TPM 28TSSOP
|
pacchetto: - |
Azione3.872 |
|
AVR | - | - | - | I2C | 4 | 3.3V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
CRYPTO EMBEDDED CONTROLLER 480 K
|
pacchetto: 84-WFBGA |
Azione4.240 |
|
ARM? Cortex?-M4F | SRAM | - | 480K x 8 | I2C, SPI, UART | 65 | 1.71 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 84-WFBGA | 84-WFBGA (7x7) |
||
Microchip Technology |
IC CRYPTO TPM 40QFN
|
pacchetto: - |
Azione4.992 |
|
AVR | - | - | - | SPI | 4 | 3.3V | 0°C ~ 70°C | - | - | - |
||
Microchip Technology |
IC CRYPTO TPM LPC 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.480 |
|
AVR | EEPROM | - | - | LPC | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Microchip Technology |
IC CRYPTO TPM TWI 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione3.504 |
|
AVR | EEPROM | - | - | I2C, 2-Wire Serial | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Microchip Technology |
IC CRYPTO TPM LPC 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione5.664 |
|
AVR | EEPROM | - | - | I2C, 2-Wire Serial | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Microchip Technology |
PL250A-AKU-Y SAMG55J19A-MU LQFP
|
pacchetto: - |
Azione4.480 |
|
External | - | - | - | SPI | - | 3 V ~ 3.6 V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
PL230A-AKU-Y SAMG55J19A-MU LQFP
|
pacchetto: - |
Azione7.200 |
|
External | - | - | - | SPI | - | 3 V ~ 3.6 V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
PL250A-AKU-R SAMG55J19A-MUT LQFP
|
pacchetto: - |
Azione6.192 |
|
External | - | - | - | SPI | - | 3 V ~ 3.6 V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
PL230A-AKU-R SAMG55J19A-MUT LQFP
|
pacchetto: - |
Azione7.152 |
|
External | - | - | - | SPI | - | 3 V ~ 3.6 V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
IC CRYPTO TPM 40QFN
|
pacchetto: - |
Azione5.136 |
|
AVR | - | - | - | I2C | 4 | 3.3V | 0°C ~ 70°C | - | - | - |