Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione4.464 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 512GBIT 83MHZ 132LBGA
|
pacchetto: - |
Azione3.392 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 2MBIT 104MHZ 8VVSOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.080 |
|
FLASH | FLASH - NOR | 2Mb (256K x 8) | SPI | 104MHz | 1ms | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VVSOP |
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Winbond Electronics |
IC FLASH 128MBIT 90NS 64LFBGA
|
pacchetto: - |
Azione5.728 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Micron Technology Inc. |
IC FLASH 128GBIT 52VLGA
|
pacchetto: 52-VLGA |
Azione3.120 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 52-VLGA | 52-VLGA (18x14) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 400MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.520 |
|
SRAM | SRAM - Synchronous, DDR II+ | 72Mb (4M x 18) | Parallel | 400MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 576KBIT 5NS 208QFP
|
pacchetto: 208-BFQFP |
Azione2.784 |
|
SRAM | SRAM - Dual Port, Synchronous | 576Kb (16K x 36) | Parallel | - | - | 5ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 20NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione7.888 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Cypress Semiconductor Corp |
IC NVSRAM 8MBIT 45NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione4.288 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x10) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 15NS 64TQFP
|
pacchetto: 64-LQFP |
Azione3.216 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 17NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione3.152 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 17ns | 17ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 3.4MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.872 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | I2C | 3.4MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione3.088 |
|
DRAM | SDRAM - DDR | 256Mb (32M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Adesto Technologies |
IC EEPROM 8-SOIC-N 1.65V SPI 128
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.312 |
|
EEPROM | EEPROM | 64kb (32B Page Size) | SPI | 20MHz | 100µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Adesto Technologies |
IC FLASH 1MBIT 104MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.384 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 104MHz | 8µs, 1.75ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 8KBIT 4MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione30.258 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC DRAM 24G 1866MHZ FBGA
|
pacchetto: - |
Azione3.344 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
ON Semiconductor |
IC EPROM 256M PARALLEL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.592 |
|
EPROM | EPROM - OTP | 256Mb (32M x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (14x11.46) |
||
Micron Technology Inc. |
TLC 128G DIE 16GX8
|
pacchetto: - |
Azione3.632 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 16G PARALLEL TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione60.000 |
|
FLASH | FLASH - NAND | 16Gb (2G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Winbond Electronics |
IC DRAM 2GBIT SSTL 15 78VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 2Gbit | SSTL_15 | 1.066 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Infineon Technologies |
IC FLASH 2GBIT SPI/QUAD 24FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 2Gbit | SPI - Quad I/O, QPI | 133 MHz | 1.7ms | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-FBGA (8x8) |
||
Alliance Memory, Inc. |
IC DRAM 2GBIT PARALLEL 78FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (7.5x10.5) |
||
Micron Technology Inc. |
IC FLASH 512GBIT MMC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 512Gbit | eMMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
Advanced Micro Devices |
IC PROM 8KBIT PARALLEL 24CDIP
|
pacchetto: - |
Request a Quote |
|
PROM | - | 8Kbit | Parallel | - | - | 50 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 24-CDIP (0.300", 7.62mm) | 24-CDIP |
||
Atmel |
IC EEPROM 1KBIT SPI 20MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | SPI | 20 MHz | 5ms | - | 2.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
RLDRAM2 Memory, 576Mbit, x18, Se
|
pacchetto: - |
Request a Quote |
|
DRAM | RLDRAM 2 | 576Mbit | HSTL | 533 MHz | - | 15 ns | 1.7V ~ 1.9V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-TWBGA (11x18.5) |
||
Micron Technology Inc. |
IC FLASH 2GBIT PARALLEL 48TSOP I
|
pacchetto: - |
Azione2.880 |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | Parallel | - | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |