Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 16MBIT 48TSOP
|
pacchetto: - |
Azione5.744 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256GBIT 83MHZ 48TSOP
|
pacchetto: - |
Azione3.072 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153WFBGA
|
pacchetto: 153-WFBGA |
Azione2.080 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 1.65 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
Renesas Electronics America |
IC EEPROM 16KBIT 400KHZ TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.384 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 166MHZ 119BGA
|
pacchetto: 119-BGA |
Azione6.288 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 133MHZ 60FBGA
|
pacchetto: 60-FBGA |
Azione3.216 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 60-FBGA | 60-FBGA (8x16) |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.432 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 30CPGA
|
pacchetto: 30-BCPGA |
Azione5.600 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 30-BCPGA | 30-CPGA |
||
Micron Technology Inc. |
IC FLASH 32GBIT TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione220.320 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 25NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.448 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (4K x 18) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 8GBIT 933MHZ FBGA
|
pacchetto: - |
Azione7.072 |
|
DRAM | SDRAM - Mobile LPDDR3 | 8Gb (128M x 64) | Parallel | 933MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 117MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.824 |
|
SRAM | SRAM - Synchronous | 4.5Mb (256K x 18) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Winbond Electronics |
IC SDRAM 2GBIT 400MHZ 134VFBGA
|
pacchetto: 134-VFBGA |
Azione5.184 |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione4.752 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128MBIT 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.896 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione5.760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 512M PARALLEL 133MHZ
|
pacchetto: 54-TFBGA |
Azione4.624 |
|
DRAM | SDRAM - Mobile | 512Mb (32M x 16) | Parallel | 133MHz | - | 6ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Cypress Semiconductor Corp |
IC 256M FLASH MEMORY
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.856 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 128KBIT PAR 100VFBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kbit | Parallel | - | 65ns | 65 ns | 1.7V ~ 1.9V, 2.4V ~ 2.6V, 2.7V ~ 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 100-VFBGA | 100-VFBGA (6x6) |
||
Silicon Motion, Inc. |
IC FLASH 256GBIT EMMC 100BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 100-LBGA | 100-BGA (14x18) |
||
ATP Electronics, Inc. |
IC FLASH 512GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (pSLC) | 512Gbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 153-FBGA | 153-BGA (11.5x13) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT PARALLEL 44TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 10ns | 10 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 64GBIT MMC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 64Gbit | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Macronix |
MEMORY
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 512MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI, DTR | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Micron Technology Inc. |
USSD 2T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 48G 2133MHZ FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 48Gbit | - | 2.133 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Renesas Electronics Corporation |
IC FLASH 32MBIT SPI/QUAD 8UDFN
|
pacchetto: - |
Azione15.000 |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 104 MHz | - | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |