Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 512GBIT 167MHZ 152TBGA
|
pacchetto: - |
Azione6.016 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 166MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 200MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione5.424 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (1M x 18) | Parallel | 200MHz | - | 7.88ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.168 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione4.368 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC OTP 2MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione7.904 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
pacchetto: - |
Azione4.240 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 36MBIT 200MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione2.768 |
|
SRAM | SRAM - Synchronous | 36Mb (1M x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 6.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.400 |
|
SRAM | SRAM - Dual Port, Synchronous | 144Kb (16K x 9) | Parallel | - | - | 6.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 25NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.352 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP |
||
Micron Technology Inc. |
IC FLASH 64GBIT 100LBGA
|
pacchetto: - |
Azione6.784 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 200MHZ 144BGA
|
pacchetto: 144-LFBGA |
Azione2.128 |
|
DRAM | SDRAM - DDR | 256Mb (8M x 32) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (12x12) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 100MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione7.520 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (256K x 36) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC FLASH 2GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione6.592 |
|
FLASH | FLASH - NAND | 2Gb (2G x 1) | SPI | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Cypress Semiconductor Corp |
IC NVSRAM 1MBIT 108MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.656 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | SPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Toshiba Semiconductor and Storage |
IC EEPROM 4GBIT 25NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione12.864 |
|
EEPROM | EEPROM - NAND | 4Gb (512M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.416 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Maxim Integrated |
IC NVSRAM 256KBIT 200NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione7.728 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 200ns | 200ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.832 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 64MBIT 55NS 48BGA
|
pacchetto: 48-TFBGA |
Azione9.672 |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Winbond Electronics |
IC FLASH MEMORY 128MB
|
pacchetto: - |
Azione3.328 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH 256MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 133 MHz | 750µs | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O | 133 MHz | 70µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 28SOJ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 20ns | 20 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.400", 10.16mm Width) | 28-SOJ |
||
Winbond Electronics |
IC PSRAM 256MBIT HYPERBS 24TFBGA
|
pacchetto: - |
Azione16.713 |
|
PSRAM | PSRAM (Pseudo SRAM) | 256Mbit | HyperBus | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 85°C (TC) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Infineon Technologies |
IC FLASH 1GBIT SPI/OCTAL 24FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Octal I/O | 166 MHz | 1.7ms | 5.45 ns | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (8x8) |
||
Micron Technology Inc. |
NAND MCP 32GBIT 149/224 VFBGA AT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FRAM 2MBIT SPI 50MHZ 8SOIC
|
pacchetto: - |
Azione1.299 |
|
FRAM | FRAM (Ferroelectric RAM) | 2Mbit | SPI | 50 MHz | - | 8 ns | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
BYTe Semiconductor |
64 MBIT, 3.0V (2.7V TO 3.6V), -4
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O | 108 MHz | 50µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |