Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics America |
IC SRAM 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.000 |
|
SRAM | SRAM | 1Mb (128K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP (8x20) |
||
Micron Technology Inc. |
IC FLASH 256MBIT 105NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione20.736 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 40MHz | 105ns | 105ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Micron Technology Inc. |
IC FLASH 256MBIT 85NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione4.864 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 52MHz | 85ns | 85ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 64-TBGA | 64-EasyBGA (8x10) |
||
STMicroelectronics |
IC EEPROM 16KBIT 5MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.360 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione14.628 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Fairchild/ON Semiconductor |
IC EEPROM 4KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.632 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 250kHz | 15ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione5.184 |
|
SRAM | SRAM - Synchronous | 18Mb (1M x 18) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 20NS 64TQFP
|
pacchetto: 64-LQFP |
Azione5.040 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 1GBIT 105NS 64LBGA
|
pacchetto: 64-LBGA |
Azione2.848 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8, 64M x 16) | Parallel | - | 60ns | 105ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-LBGA (11x13) |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 55NS 48VFBGA
|
pacchetto: 48-VFBGA |
Azione5.232 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8) | Parallel | - | 55ns | 55ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (8x9.5) |
||
Alliance Memory, Inc. |
IC SRAM 2MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.952 |
|
SRAM | SRAM - Asynchronous | 2Mb (256K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.008 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione46.368 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione8.628 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | - | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
STMicroelectronics |
IC EEPROM 2KBIT 5MHZ 8UFDFPN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione10.764 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione8.784 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.584 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione2.208 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K PARALLEL 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.576 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Micron Technology Inc. |
MEMORY DRAM
|
pacchetto: - |
Azione7.312 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione2.064 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Renesas Electronics Corporation |
IC SRAM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 2GBIT HSUL 12 134VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Winbond Electronics |
1GB LPDDR4X, X16, 1600MHZ, -40C~
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 1Gbit | LVSTL_06 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Winbond Electronics |
IC DRAM 1GBIT SSTL 15 96VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 1Gbit | SSTL_15 | 667 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 105°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Renesas Electronics Corporation |
IC SRAM 256KBIT PARALLEL 28CDIP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous | 256Kbit | Parallel | - | 100ns | 100 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |