Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH 512MBIT 100NS SMD
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.936 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | - | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (18.4x14) |
||
Micron Technology Inc. |
LPDDR3 SPECIAL/CUSTOM PLASTIC GR
|
pacchetto: - |
Azione4.544 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 8GBIT 137VFBGA
|
pacchetto: 137-VFBGA |
Azione6.144 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (256M x 16)(NAND), 4Gb (128M x 32)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 137-VFBGA | 137-VFBGA (13x10.5) |
||
Microchip Technology |
IC FLASH 16MBIT 100MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione340.860 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
STMicroelectronics |
IC FLASH 512MBIT 50NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.864 |
|
FLASH | FLASH - NAND | 512Mb (64M x 8) | Parallel | - | 50ns | 50ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 125MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione7.472 |
|
DRAM | SDRAM - Mobile LPSDR | 256Mb (8M x 32) | Parallel | 125MHz | 15ns | 7ns | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC FLASH 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione60.504 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione4.384 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC FLASH 512KBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.328 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 30µs | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 15NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.184 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 55NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.416 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC FLASH 64MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione4.592 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.688 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ON Semiconductor |
IC EEPROM 16KBIT I2C 6WLCSP
|
pacchetto: - |
Azione2.640 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Toshiba Semiconductor and Storage |
IC EEPROM 4GBIT 25NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione5.232 |
|
EEPROM | EEPROM - NAND | 4Gb (512M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Adesto Technologies |
IC FLASH 512KBIT 85MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.168 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 104MHz | 8µs, 1.75ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EEPROM 512KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.400 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 16MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 145°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Adesto Technologies |
IC FLASH 4MBIT 85MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.064 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 85MHz | 8µs, 2.75ms | - | 1.65 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
512M - C DIE NEW 32M X 16 3.3V 1
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione6.768 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 133MHz | 15ns | 17ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 133MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione28.008 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Winbond Electronics |
IC FLASH MEMORY 16MB
|
pacchetto: - |
Azione8.736 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione2.096 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
LPDDR4 16G 1GX16 FBGA DDP
|
pacchetto: - |
Azione5.584 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (256M x 64) | - | - | - | - | 1.1V | 0°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM DDR4 8G PAR 78FBGA
|
pacchetto: 78-TFBGA |
Azione4.576 |
|
DRAM | SDRAM - DDR4 | 8Gb (1G x 8) | Parallel | 1.6GHz | 15ns | 19ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (7.5x11) |
||
Winbond Electronics |
IC FLASH 512MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 512Mbit | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X16, 1066
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 1.067 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
ISSI, Integrated Silicon Solution Inc |
64Mb QPI/QPI/QSPI, 8-pin WSON6X8
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 40µs, 800µs | - | 2.3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Winbond Electronics |
4GB LPDDR4X, DDP, X32, 2133MHZ,
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |