Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 24TFBGA
|
pacchetto: 24-TBGA |
Azione5.616 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 400MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.296 |
|
SRAM | SRAM - Synchronous, QDR II+ | 18Mb (1M x 18) | Parallel | 400MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
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Microchip Technology |
IC FLASH 256KBIT 120NS 28TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.296 |
|
FLASH | FLASH | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 90NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione1.454.736 |
|
FLASH | FLASH | 1Mb (64K x 16) | Parallel | - | 50µs | 90ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.232 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 15NS 256CABGA
|
pacchetto: 256-LBGA |
Azione6.960 |
|
SRAM | SRAM - Dual Port, Asynchronous | 9Mb (256K x 36) | Parallel | - | 15ns | 15ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 208MHZ 168WFBGA
|
pacchetto: 168-WFBGA |
Azione5.472 |
|
DRAM | SDRAM - Mobile LPDDR | 4Gb (128M x 32) | Parallel | 208MHz | 14.4ns | 5.0ns | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione3.152 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Winbond Electronics |
IC SDRAM 128MBIT 250MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione3.696 |
|
DRAM | SDRAM - DDR | 128Mb (8M x 16) | Parallel | 250MHz | 12ns | 48ns | 2.4 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Rohm Semiconductor |
IC EEPROM 4KBIT 400KHZ 8TSSOP-B
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.168 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 3MHZ 8VSON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione34.608 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | VSON008X2030 |
||
Cypress Semiconductor Corp |
IC 1 GB FLASH MEMORY
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.264 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | SPI - Quad I/O | 80MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione2.416 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 44FBGA
|
pacchetto: 44-VFBGA |
Azione4.288 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 108MHz | 60ns | 80ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 44-VFBGA | 44-FBGA (7.5x5) |
||
Cypress Semiconductor Corp |
IC NOR
|
pacchetto: 24-TBGA |
Azione5.968 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O, QPI | 66MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione6.192 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16K PARALLEL 64TQFP
|
pacchetto: 64-LQFP |
Azione6.640 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Micron Technology Inc. |
IC DRAM 16G 933MHZ FBGA
|
pacchetto: - |
Azione6.608 |
|
DRAM | SDRAM - Mobile LPDDR3 | 16Gb (256M x 64) | - | 933MHz | - | - | 1.2V | -30°C ~ 85°C (TC) | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Everspin Technologies Inc. |
IC RAM 32MBIT XSPI/QUAD 24TBGA
|
pacchetto: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 32Mbit | xSPI - Quad I/O | 133 MHz | - | - | 1.65V ~ 2V | 0°C ~ 70°C | Surface Mount | 24-TBGA | 24-TBGA (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4MBIT SPI/DUAL 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 4Mbit | SPI - Dual I/O | 50 MHz | 100µs, 6ms | 12 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (1.5x1.5) |
||
Micron Technology Inc. |
IC DRAM 24GBIT 2.133GHZ FBGA QDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gbit | - | 2.133 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Infineon Technologies |
IC FLASH 128MBIT SPI 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI | 133 MHz | 2ms | - | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 63VFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 104 MHz | 50µs, 3ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O, QPI, DTR | 104 MHz | 600µs | 9.5 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
32Mb, SerialRAM, 1.65V-1.95V, 10
|
pacchetto: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 32Mbit | SPI, QPI | 104 MHz | - | 7 ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 1MBIT SPI/QUAD I/O 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Mbit | SPI - Quad I/O | - | - | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 2Gbit | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | 134-TFBGA (10x11.5) |