Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC LPDDR2PCM/LPDDR2 1.5GBIT FBGA
|
pacchetto: 121-WFBGA |
Azione3.856 |
|
RAM | PCM - LPDDR2, MCP - LPDDR2 | 1Gb (128M x 8)(PCM), 512Mb (64M x 8)(MCP) | Parallel | 166MHz | - | - | 1.14 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 121-WFBGA | 121-VFBGA (11x10) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione2.432 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione6.880 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.288 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 1MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.728 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.056 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 166MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione3.312 |
|
DRAM | SDRAM - Mobile DDR | 512Mb (16M x 32) | Parallel | 166MHz | 12ns | 5.5ns | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 105NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione6.288 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | 40MHz | 105ns | 105ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Winbond Electronics |
IC SDRAM 2GBIT 400MHZ 168WFBGA
|
pacchetto: 168-WFBGA |
Azione4.032 |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 60NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione12.276 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 60ns | 60ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.064 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
SII Semiconductor Corporation |
IC EEPROM 16KBIT 2MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione137.820 |
|
EEPROM | EEPROM | 16Kb (1K x 16) | SPI | 2MHz | 4ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Maxim Integrated |
IC NVSRAM 1MBIT 100NS 34PCM
|
pacchetto: 34-PowerCap? Module |
Azione5.488 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 100ns | 100ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 34-PowerCap? Module | 34-PowerCap Module |
||
Toshiba Semiconductor and Storage |
IC EEPROM 1GBIT 25NS 63TFBGA
|
pacchetto: 63-VFBGA |
Azione7.168 |
|
EEPROM | EEPROM - NAND | 1Gb (128M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-TFBGA (9x11) |
||
ON Semiconductor |
IC EEPROM 2K SPI 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.200 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Macronix |
IC FLASH 2GBIT
|
pacchetto: - |
Azione3.712 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC SDRAM 1GBIT 96BGA
|
pacchetto: - |
Azione7.776 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Swissbit |
IC FLASH 2GBIT EMMC 153LFBGA
|
pacchetto: 153-LFBGA |
Azione5.488 |
|
FLASH | FLASH - NAND (pSLC) | 2Gb (256M x 8) | eMMC | 400MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 153-LFBGA | 153-LFBGA (11.5x13) |
||
Cypress Semiconductor Corp |
IC USB WIRED BRIDGE 121BGA
|
pacchetto: - |
Azione6.480 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC RAM DUAL PORT
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kbit | Parallel | - | 12ns | 12 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Fujitsu Semiconductor Memory Solution |
64KBIT FRAM WITH SPI 1.8V~3.6V -
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kbit | SPI | 10 MHz | - | 18 ns | 1.8V ~ 3.6V | -55°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC DRAM 8GBIT LPDDR4 TFBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | 200-VFBGA | 200-VFBGA (10x14.5) |
||
Infineon Technologies |
INFINEON
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
ASYNC RAM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 1T 128GX8 VBGA DDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
BYTe Semiconductor |
4 MBIT, 1.8V (1.65V TO 2.0V), -4
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 4Mbit | SPI - Quad I/O | 50 MHz | 3ms | 17 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Micron Technology Inc. |
LPDDR4 0 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 4G 128MX32 FBGA DDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |