Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 16MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.888 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Winbond Electronics |
IC FLASH 8MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.824 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 80MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione5.040 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 45ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Micron Technology Inc. |
IC FLASH 128MBIT 85NS 80LBGA
|
pacchetto: 80-LBGA |
Azione5.728 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 52MHz | 85ns | 85ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 80-LBGA | 80-LBGA (10x12) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.568 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.824 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.656 |
|
SRAM | SRAM - Synchronous | 4.5Mb (256K x 18) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 32MBIT 133MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione4.192 |
|
DRAM | SDRAM - Mobile | 32Mb (2M x 16) | Parallel | 133MHz | - | 6ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Macronix |
IC FLASH 8MBIT 90NS 44SOP
|
pacchetto: 44-SOIC (0.496", 12.60mm Width) |
Azione6.320 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-SOIC (0.496", 12.60mm Width) | 44-SOP |
||
Microchip Technology |
IC EEPROM 8KBIT 10MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.096 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Winbond Electronics |
SPIFLASH, 8M-BIT, 4KB UNIFORM SE
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.544 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 3ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione86.400 |
|
SRAM | SRAM - Synchronous | 4Mb (128K x 32) | Parallel | 133MHz | - | 4ns | 3.15 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Macronix |
IC FLASH 512KBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione36.516 |
|
FLASH | FLASH - NOR | 512Kb (64K x 8) | SPI | 33MHz | 100µs, 10ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione16.086 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (6x8) |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 4-XFBGA, CSPBGA |
Azione39.600 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, CSPBGA | 4-CSP |
||
Cypress Semiconductor Corp |
IC FLASH 8M PARALLEL 48FBGA
|
pacchetto: 48-VFBGA |
Azione6.064 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
pacchetto: - |
Azione4.160 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
MODULE EMMC 153TFBGA
|
pacchetto: 153-TFBGA |
Azione6.672 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 28SOJ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 25ns | 25 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Winbond Electronics |
IC DRAM 2GBIT LVSTL 11 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Flexxon Pte Ltd |
IC FLASH 128GBIT EMMC 153FBGA
|
pacchetto: - |
Azione63 |
|
FLASH | FLASH - NAND (pMLC) | 128Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
Micron Technology Inc. |
LPDDR5 48GBIT 32 315/315 TFBGA 4
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5X | 48Gbit | LVSTL | 4.266 GHz | - | - | 1.01V ~ 1.12V | -25°C ~ 85°C (TC) | Surface Mount | 315-TFBGA | 315-TFBGA (12.4x15) |
||
Winbond Electronics |
IC FLASH 256MBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Winbond Electronics |
SPIFLASH, 3V, 256M-BIT, 4KB UNIF
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Micron Technology Inc. |
LPDDR5 96G 1.5GX64 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 32SOIC
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 70ns | 70 ns | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 4.5MBIT PAR 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR | 4.5Mbit | Parallel | 100 MHz | - | 8 ns | 3.15V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Insignis Technology Corporation |
DDR2 1GB X8 FBGA 8X10 (X1.2) 800
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR2 | 1Gbit | SSTL_18 | 400 MHz | - | - | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |