Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 512GBIT 100MHZ 132TBGA
|
pacchetto: - |
Azione7.040 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 100MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 800MHZ FBGA
|
pacchetto: - |
Azione2.688 |
|
DRAM | SDRAM - Mobile LPDDR3 | 16Gb (512M x 32) | Parallel | 800MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 16MBIT 55NS 44TSOP
|
pacchetto: 48-TFBGA |
Azione2.592 |
|
PSRAM | PSRAM (Pseudo SRAM) | 16Mb (1M x 16) | Parallel | - | 55ns | 55ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-BGA (6x8) |
||
Adesto Technologies |
IC FLASH 1MBIT 66MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione6.256 |
|
FLASH | FLASH | 1Mb (256 Bytes x 512 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Winbond Electronics |
IC FLASH 64MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione703.200 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Rohm Semiconductor |
IC DRAM 16MBIT 60NS 42SOJ
|
pacchetto: - |
Azione5.360 |
|
DRAM | DRAM | 16Mb (1M x 16) | Parallel | - | - | 30ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 16MBIT 90NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.056 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 90ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.360 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (1M x 36) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.920 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC NVSRAM 1MBIT 35NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione6.684 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 35ns | 35ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 1.5MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.952 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8SO
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.136 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 10ms | 900ns | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.376 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 200MHz | - | 3ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
pacchetto: - |
Azione6.160 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
NON VOLATILE SRAMS
|
pacchetto: - |
Azione4.208 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | SPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione4.640 |
|
FLASH | FLASH - NAND | 4Gb (256M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione5.968 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.864 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.248 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione5.008 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 60ns | 80ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Micron Technology Inc. |
IC FLASH 32G PARALLEL 83MHZ
|
pacchetto: - |
Azione7.216 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC DRAM 8G 1600MHZ FBGA
|
pacchetto: - |
Azione5.280 |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gb (256M x 32) | - | 1600MHz | - | - | 1.1V | -30°C ~ 105°C (TC) | - | - | - |
||
Catalyst Semiconductor Inc. |
IC EEPROM 8KBIT SPI 10MHZ 8TSSOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 8Kbit | SPI | 10 MHz | 5ms | - | 2.5V ~ 6V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O, QPI | 133 MHz | 100µs, 4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 125°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-USON (4x4) |
||
onsemi |
IC EEPROM 1KBIT MICROWIRE 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 4 MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
TLC 4T X8 LBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O, DTR | 104 MHz | 600µs | 9.5 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
256MBIT, 1.8V, SOP8 208MIL, INDU
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI | 133 MHz | 60µs, 2.4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |