Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione4.880 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128GBIT 153VFBGA
|
pacchetto: - |
Azione2.512 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC PCM 128MBIT 115NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione2.288 |
|
PCM (PRAM) | PCM (PRAM) | 128Mb (16M x 8) | Parallel, SPI | - | 115ns | 115ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione20.304 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 55NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.224 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 55ns | 55ns | 2.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Winbond Electronics |
IC FLASH 32MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.952 |
|
FLASH | FLASH | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 576KBIT 5NS 208CABGA
|
pacchetto: 208-LFBGA |
Azione4.624 |
|
SRAM | SRAM - Dual Port, Synchronous | 576Kb (16K x 36) | Parallel | - | - | 5ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.776 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (1M x 18) | Parallel | - | - | 7.5ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 15NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.856 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 25NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione7.152 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153VFBGA
|
pacchetto: - |
Azione4.352 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 2GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione325.368 |
|
FLASH | FLASH - NAND | 2Gb (256M x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 10NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione3.744 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 10ns | 10ns | 3.15 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.576 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ON Semiconductor |
IC EEPROM 8KBIT 400KHZ 4WLCSP
|
pacchetto: 4-XFBGA, WLCSP |
Azione6.096 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, WLCSP | 4-WLCSP |
||
Everspin Technologies Inc. |
IC MRAM 16MBIT 35NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.176 |
|
RAM | MRAM (Magnetoresistive RAM) | 16Mb (2M x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 |
||
Micron Technology Inc. |
IC FLASH 1MBIT 50MHZ 8VFDFPN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.792 |
|
FLASH | FLASH - NOR | 1Mb (128K x 8) | SPI | 50MHz | 15ms, 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VFQFPN (6x5) |
||
Micron Technology Inc. |
IC SDRAM LPDDR4 4G ?? ? QDP
|
pacchetto: - |
Azione7.088 |
|
DRAM | SDRAM - Mobile LPDDR4 | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC EPROM 256K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) Window |
Azione7.568 |
|
EPROM | EPROM - UV | 256Kb (32K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
Winbond Electronics |
IC FLASH MEMORY 128MB
|
pacchetto: - |
Azione2.688 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 8G PARALLEL 800MHZ FBGA
|
pacchetto: - |
Azione4.960 |
|
DRAM | SDRAM - Mobile LPDDR3 | 8Gb (128M x 64) | Parallel | 800MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC FLASH RAM 2G PARALLEL 533MHZ
|
pacchetto: - |
Azione2.848 |
|
FLASH, RAM | FLASH - NAND, DRAM - LPDDR2 | 2Gb (256M x 8)(NAND), 2G (64M x 32)(LPDDR2) | Parallel | 533MHz | - | - | 1.8V | -25°C ~ 85°C (TA) | - | - | - |
||
Winbond Electronics |
IC SDRAM 2G DDR3 78WBGA
|
pacchetto: 78-VFBGA |
Azione4.864 |
|
DRAM | SDRAM - DDR3L | 2Gb (256M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 128MBIT SPI/OCT 24TFBGA
|
pacchetto: - |
Azione1.410 |
|
FLASH | FLASH | 128Mbit | SPI - Octal I/O | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Infineon Technologies |
IC MEM NOR 16SOIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4MBIT SPI/DUAL 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 4Mbit | SPI - Dual I/O | 104 MHz | 100µs, 6ms | 6 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Alliance Memory, Inc. |
IC DRAM 4GBIT PAR 96FBGA
|
pacchetto: - |
Azione5.490 |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13.5) |
||
Winbond Electronics |
SECURE SPIFLASH, 1.8V, 256MB+32M
|
pacchetto: - |
Azione1.152 |
|
FLASH | FLASH - NOR | 32Mbit | SPI | 133 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |