Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR 64MBIT 24FBGA
|
pacchetto: - |
Azione6.640 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Winbond Electronics |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: 8-UDFN Exposed Pad |
Azione34.788 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (4x3) |
||
Adesto Technologies |
IC FLASH 4MBIT 66MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.016 |
|
FLASH | FLASH | 4Mb (256 Bytes x 2048 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Micron Technology Inc. |
IC FLASH 32MBIT 70NS 64FBGA
|
pacchetto: 64-LBGA |
Azione6.928 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (11x13) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 8GBIT 168VFBGA
|
pacchetto: 168-VFBGA |
Azione7.024 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (512M x 8)(NAND), 4Gb (128M x 32)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 70NS 64TFBGA
|
pacchetto: 64-VFBGA |
Azione4.560 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFBGA | 64-TFBGA (10.5x6.39) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione3.888 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione5.616 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.680 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 256FBGA
|
pacchetto: 256-LBGA |
Azione5.312 |
|
SRAM | SRAM - Dual Port, Synchronous | 18Mb (1M x 18) | Parallel | 167MHz | - | 4ns | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | 256-FBGA (17x17) |
||
Microchip Technology |
IC OTP 2MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.248 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.800 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 35NS 68PGA
|
pacchetto: 68-BPGA |
Azione4.384 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 68-BPGA | 68-PGA (29.46x29.46) |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 933MHZ FBGA
|
pacchetto: - |
Azione5.440 |
|
DRAM | SDRAM - Mobile LPDDR3 | 16Gb (256M x 64) | - | 933MHz | - | - | 1.2V | - | - | - | - |
||
Renesas Electronics America |
IC SRAM 1MBIT 55NS 32SOP
|
pacchetto: 32-SOIC (0.450", 11.40mm Width) |
Azione6.832 |
|
SRAM | SRAM | 1Mb (128K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.450", 11.40mm Width) | 32-SOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 2MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione406.728 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 10ns | 10ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 128MBIT 108MHZ 8VPDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.264 |
|
FLASH | FLASH - NOR | 128Mb (32M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFPN (6x5) (MLP8) |
||
Microchip Technology |
IC EEPROM 4KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.256 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.584 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 133MHz | - | 6.5ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Adesto Technologies |
IC EEPROM 256KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione21.780 |
|
EEPROM | EEPROM | 256kb (64B Page Size) | I2C | 1MHz | 100µs, 5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Adesto Technologies |
IC FLASH 32MBIT 85MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione71.424 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 85MHz | 8µs, 4ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x8) |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.256 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC FLASH 8M PARALLEL 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione19.500 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Renesas Electronics Corporation |
QDR SRAM, 4MX9, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 4GBIT PAR 96VFBGA
|
pacchetto: - |
Azione294 |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Renesas Electronics Corporation |
DDR SRAM, 1MX18, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH 1GBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Quad I/O, QPI | 133 MHz | - | - | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |