Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEMORY 1GB FLASH 3.0V 64FBGA
|
pacchetto: - |
Azione5.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 165CABGA
|
pacchetto: 165-TBGA |
Azione6.432 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 200MHZ 119BGA
|
pacchetto: 119-BBGA |
Azione3.584 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 119-BBGA | 119-PBGA (14x22) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.096 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione16.032 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 166MHZ 208FBGA
|
pacchetto: 208-LFBGA |
Azione4.576 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (128K x 18) | Parallel | 166MHz | - | 3.6ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 166MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione12.312 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 119BGA
|
pacchetto: 119-BGA |
Azione4.560 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 183MHZ 119BGA
|
pacchetto: 119-BGA |
Azione2.864 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 183MHz | - | 3.3ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 267MHZ 84BGA
|
pacchetto: 84-TFBGA |
Azione2.464 |
|
DRAM | SDRAM - DDR2 | 256Mb (16M x 16) | Parallel | 266MHz | 15ns | 500ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
||
Microchip Technology |
IC EEPROM 2KBIT 4MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.768 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.312 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione2.608 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 200MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione18.864 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (8x12.5) |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione396.000 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Fremont Micro Devices USA |
IC EEPROM 2KBIT 1MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione52.884 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
ON Semiconductor |
IC EPROM 512K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) Window |
Azione3.872 |
|
EPROM | EPROM - UV | 512Kb (64K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
Cypress Semiconductor Corp |
IC FLASH 4G PARALLEL 63BGA
|
pacchetto: 63-VFBGA |
Azione2.560 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | 25ns | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 63-VFBGA | 63-BGA (11x9) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512K PARALLEL 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione5.328 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Macronix |
IC FLASH 16M 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.064 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI - Quad I/O | 80MHz | 100µs, 4ms | - | 2.3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Renesas Electronics Corporation |
STANDARD SRAM, 2MX36
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Insignis Technology Corporation |
DDR3L 512MB X16 FBGA 8X13(X1.0)
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 512Mbit | Parallel | 800 MHz | - | - | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-FBGA (8x13) |
||
Fairchild Semiconductor |
IC EEPROM 4KBIT MICROWIRE 8DIP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 4Kbit | Microwire | 1 MHz | 10ms | - | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 8MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 8Mbit | SPI - Quad I/O | 104 MHz | 120µs, 4ms | 12 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (3x2) |
||
onsemi |
IC EEPROM 1KBIT I2C 400KHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | I2C | 400 kHz | 5ms | 900 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fairchild Semiconductor |
IC EEPROM 2KBIT MICROWIRE 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | Microwire | 250 kHz | 15ms | - | 2.7V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT I2C 8DIP
|
pacchetto: - |
Azione900 |
|
EEPROM | EEPROM | 512Kbit | I2C | 3.4 MHz | 5ms | 400 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |