Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
IC EPROM UV 16MBIT 100NS 42CDIP
|
pacchetto: 42-CDIP (0.600", 15.24mm) Window |
Azione4.768 |
|
EPROM | EPROM - UV | 16Mb (2M x 8, 1M x 16) | Parallel | - | - | 100ns | 3.14 V ~ 3.47 V | 0°C ~ 70°C (TA) | Through Hole | 42-CDIP (0.600", 15.24mm) Window | 42-CDIP Frit Seal with Window |
||
Maxim Integrated |
IC NVSRAM 16KBIT 150NS 24EDIP
|
pacchetto: 24-DIP Module (0.600", 15.24mm) |
Azione4.672 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Kb (2K x 8) | Parallel | - | 150ns | 150ns | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Through Hole | 24-DIP Module (0.600", 15.24mm) | 24-EDIP |
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Microchip Technology |
IC FLASH 2MBIT 120NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.352 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
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Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.256 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.792 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 55NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.648 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 100MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione7.184 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC FLASH 4GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione2.464 |
|
FLASH | FLASH - NAND | 4Gb (256M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 10NS 36SOJ
|
pacchetto: 36-BSOJ (0.400", 10.16mm Width) |
Azione6.704 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
STMicroelectronics |
IC EEPROM 4KBIT 400KHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione51.354 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 32K SPI 10MHZ WAFER
|
pacchetto: Die |
Azione4.544 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
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ON Semiconductor |
IC EEPROM 4K SPI 1MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.408 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 1MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
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ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5M PARALLEL 200MHZ
|
pacchetto: 165-TFBGA |
Azione5.856 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TFBGA | 165-TFBGA (13x15) |
||
Microchip Technology |
IC EEPROM 2M I2C 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.520 |
|
EEPROM | EEPROM | 2Mb (256K x 8) | I²C | 1MHz | 10ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 64G MMC 153BGA
|
pacchetto: - |
Azione2.128 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT PAR 225MHZ 119PBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR | 9Mbit | Parallel | 225 MHz | - | 2.8 ns | 3.135V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC FLASH 1GBIT SPI 24TPBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O | 133 MHz | 8ms, 2.8ms | - | 1.7V ~ 2V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Renesas Electronics Corporation |
STANDARD SRAM, 4MX18, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
1Mb,High-Speed/Low Power,Async w
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 10ns | 10 ns | 2.4V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
Microchip Technology |
IC EEPROM 1KBIT I2C 400KHZ 8DIP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | I2C | 400 kHz | 5ms | 900 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
LPDDR5 48GBIT 32 315/315 TFBGA 4
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5X | 48Gbit | LVSTL | 4.266 GHz | - | - | 1.01V ~ 1.12V | -40°C ~ 105°C (TC) | Surface Mount | 315-TFBGA | 315-TFBGA (12.4x15) |
||
Winbond Electronics |
IC FLASH 32MBIT SPI/QUAD 8XSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-XSON (4x4) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT HSUL 12 168VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 4Gbit | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Micron Technology Inc. |
LPDDR4 16G 512MX32 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Renesas Electronics Corporation |
IC RAM 4MBIT SPI 54MHZ 8DFN
|
pacchetto: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 4Mbit | SPI | 54 MHz | - | - | 1.71V ~ 2V | -40°C ~ 85°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (5x6) |
||
Texas Instruments |
OTP ROM, 32KX8, 170NS PQCC32
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - UV | 256Kbit | Parallel | - | - | 170 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 128Kbit | Parallel | 40 MHz | 20ns | 20 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Renesas Electronics Corporation |
STANDARD SRAM, 512KX16, 55NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |