Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 2TBIT 167MHZ 272LBGA
|
pacchetto: - |
Azione4.480 |
|
FLASH | FLASH - NAND | 2Tb (256G x 8) | Parallel | 167MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 45NS 48BGA
|
pacchetto: 48-TFBGA |
Azione5.184 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 45ns | 45ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Renesas Electronics America |
IC SRAM 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.888 |
|
SRAM | SRAM | 1Mb (128K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP (8x20) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 267MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.088 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (2M x 18) | Parallel | 267MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione3.616 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 100MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione6.976 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Microchip Technology |
IC FLASH 64MBIT 100MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione9.828 |
|
FLASH | FLASH | 64Mb (256 Bytes x 32K pages) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x8) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 80NS 40TSOP
|
pacchetto: 40-TFSOP (0.724", 18.40mm Width) |
Azione6.032 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 80ns | 80ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 40-TFSOP (0.724", 18.40mm Width) | 40-TSOP I |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.240 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.448 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 25NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione5.312 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 20NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione3.024 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione7.904 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.992 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.656 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Macronix |
IC FLASH 8MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione24.942 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 108MHz | 100µs, 4ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 104MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione4.592 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 104MHz | 5µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Micron Technology Inc. |
IC FLASH 256M SPI 133MHZ 8WPDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.312 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WPDFN (6x8) (MLP8) |
||
Micron Technology Inc. |
MODULE EMMC 4GB 100LBGA
|
pacchetto: 153-TFBGA |
Azione3.120 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
||
Insignis Technology Corporation |
LPDDR4 8GB X32 3200MHZ CL22 10X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 0°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Quality Semiconductor |
IC SRAM 128KBIT 40MHZ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 128Kbit | - | 40 MHz | 25ns | 25 ns | 5V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC EPROM 512KBIT PARALLEL 32PLCC
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - OTP | 512Kbit | Parallel | - | - | 120 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
ISSI, Integrated Silicon Solution Inc |
128Mb QPI/QSPI, 24-ball TFBGA 6x
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 40µs, 800µs | 5.5 ns | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH SLC 8GB TSOP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
256Mb, OctalRAM, 32Mbx8, 3.0V, 1
|
pacchetto: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 256Mbit | SPI - Octal I/O | 133 MHz | 37.5ns | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Flexxon Pte Ltd |
IC FLASH 128GBIT EMMC 100FBGA
|
pacchetto: - |
Azione408 |
|
FLASH | FLASH - NAND (MLC) | 128Gbit | eMMC_5 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-FBGA (14x18) |
||
Renesas Electronics Corporation |
IC SRAM 256KBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Standard | 256Kbit | Parallel | 66 MHz | - | 20 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |