Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.696 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Renesas Electronics America |
IC SRAM 32MBIT 55NS 48FBGA
|
pacchetto: - |
Azione5.712 |
|
SRAM | SRAM | 32Mb (2M x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH 64MBIT 60NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.808 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 60ns | 60ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153WFBGA
|
pacchetto: 153-WFBGA |
Azione4.464 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 100MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.136 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (1M x 18) | Parallel | 100MHz | - | 5ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 250MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione5.024 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (512K x 36) | Parallel | 250MHz | - | 8.4ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione5.840 |
|
DRAM | SDRAM | 256Mb (64M x 4) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC FLASH 64MBIT 85NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione6.080 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | 52MHz | 85ns | 85ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-EasyBGA (10x13) |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.736 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC NVSRAM 2MBIT 70NS 32EDIP
|
pacchetto: 32-DIP Module (0.600", 15.24mm) |
Azione5.008 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 2Mb (256K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 32-DIP Module (0.600", 15.24mm) | 32-EDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 10NS 208CABGA
|
pacchetto: 208-LFBGA |
Azione4.672 |
|
SRAM | SRAM - Dual Port, Asynchronous | 2Mb (64K x 36) | Parallel | - | 10ns | 10ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
Winbond Electronics |
IC PSRAM 256MBIT 133MHZ 54VFBGA
|
pacchetto: 54-VFBGA |
Azione6.704 |
|
PSRAM | PSRAM (Pseudo SRAM) | 256Mb (16M x 16) | Parallel | 133MHz | - | 70ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 54-VFBGA | 54-VFBGA (6x8) |
||
Macronix |
IC FLASH 8MBIT 45NS 48LFBGA
|
pacchetto: 48-LFBGA, CSPBGA |
Azione2.960 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-LFBGA, CSPBGA | 48-LFBGA, CSP (6x8) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.312 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8VFBGA
|
pacchetto: 8-VFBGA |
Azione6.368 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFBGA | 8-VFBGA (1.5x2) |
||
Alliance Memory, Inc. |
IC SRAM 8MBIT 55NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione14.820 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC DRAM 16G 1600MHZ
|
pacchetto: - |
Azione7.920 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 1600MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione6.624 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 60ns | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Alliance Memory, Inc. |
IC SRAM 16M PARALLEL 48TFBGA
|
pacchetto: 48-LFBGA |
Azione6.224 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8) | Parallel | - | 10ns | 10ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-LFBGA | 48-TFBGA (6x8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8K PARALLEL 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione4.624 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Cypress Semiconductor Corp |
IC SRAM ASYNC 85SOJ
|
pacchetto: - |
Azione5.008 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128MBIT PAR 54TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Micron Technology Inc. |
LPDDR4 12GBIT 16 200/264 TFBGA 1
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SRAM 128KBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kbit | Parallel | - | 15ns | 15 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Insignis Technology Corporation |
SDR 256MB X8 TSOPII 54L 10X22(X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 200 MHz | 10ns | 4.5 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 128Kbit | Parallel | 25 MHz | 35ns | 35 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/QUAD 24FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI | 166 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |