Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEMORY 512MB PAGE
|
pacchetto: - |
Azione3.888 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC RLDRAM 288MBIT 400MHZ 144UBGA
|
pacchetto: 144-TFBGA |
Azione6.768 |
|
DRAM | DRAM | 288Mb (8M x 36) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 10NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.888 |
|
SRAM | SRAM - Synchronous | 1Mb (32K x 32) | Parallel | - | - | 10ns | 3.135 V ~ 3.63 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.960 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 45NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione3.424 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Micron Technology Inc. |
IC FLASH 256MBIT 85NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione3.056 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 52MHz | 85ns | 85ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-EasyBGA (10x13) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 333MHZ 63FBGA
|
pacchetto: 63-FBGA |
Azione2.032 |
|
DRAM | SDRAM - DDR2 | 2Gb (512M x 4) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 63-FBGA | 63-FBGA (9x11.5) |
||
Winbond Electronics |
IC FLASH 4MBIT 75MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.440 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 75MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC OTP 256KBIT 120NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.440 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.224 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 12NS 80TQFP
|
pacchetto: 80-LQFP |
Azione2.512 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (8K x 9) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 333MHZ 84BGA
|
pacchetto: 84-LFBGA |
Azione4.992 |
|
DRAM | SDRAM - DDR2 | 2Gb (128M x 16) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LFBGA | 84-LFBGA (10.5x13.5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 35NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.256 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Macronix |
IC FLASH 256MBIT 108MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.448 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 108MHz | 30µs, 3ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Microchip Technology |
IC EEPROM 16KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.216 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.856 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
64MB QPI/QSPI WSON ET
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.520 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 133MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Microchip Technology |
IC EEPROM 1MBIT 20MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione49.716 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 20MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Rohm Semiconductor |
IC EEPROM 128KBIT 400KHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione2.176 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC DRAM 12G 1866MHZ
|
pacchetto: - |
Azione7.232 |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gb (384M x 32) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Renesas Electronics America |
IC SRAM 4M FAST 36-SOJ
|
pacchetto: 36-BSOJ (0.400", 10.16mm Width) |
Azione2.544 |
|
SRAM | SRAM | 4Mb (512K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
Maxim Integrated |
IC INTEGRATED CIRCUIT
|
pacchetto: - |
Azione6.992 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 1T 128GX8 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GSI Technology Inc. |
IC SRAM 288MBIT PAR 165FPBGA
|
pacchetto: - |
Azione234 |
|
SRAM | SRAM - Quad Port, Synchronous, QDR II+ | 288Mbit | Parallel | 550 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (15x17) |
||
Renesas Electronics Corporation |
IC SRAM 256KBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kbit | Parallel | - | 25ns | 25 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT HSUL 12 168VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gbit | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Renesas Electronics Corporation |
IC SRAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | LVTTL | - | 12ns | 12 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
LPDDR4 48G 1.5GX32 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 48Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -25°C ~ 85°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |