Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 8GBIT 933MHZ 78FBGA
|
pacchetto: 78-TFBGA |
Azione4.896 |
|
DRAM | SDRAM - DDR3L | 8Gb (1G x 8) | Parallel | 933MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9.5x11.5) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 333MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.352 |
|
SRAM | SRAM - Synchronous, DDR II | 72Mb (2M x 36) | Parallel | 333MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 15NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione9.000 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Micron Technology Inc. |
IC FLASH 4MBIT 33MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione63.972 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | 33MHz | - | 250ns | 3 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 200MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione4.208 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 200MHz | - | 3ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC FLASH 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione10.080 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 150ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 800MHZ 168BGA
|
pacchetto: 168-LBGA |
Azione7.168 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 800MHz | - | 12ns | 1.28 V ~ 1.42 V | -40°C ~ 85°C (TA) | Surface Mount | 168-LBGA | 168-FC(LF)BGA (13.5x13.5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 6.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.816 |
|
SRAM | SRAM - Dual Port, Synchronous | 144Kb (8K x 18) | Parallel | - | - | 6.5ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 32GBIT TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.592 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 150MHZ 119BGA
|
pacchetto: 119-BGA |
Azione4.672 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 150MHz | - | 3.8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 35NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.104 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 208MHZ 60VFBGA
|
pacchetto: 60-VFBGA |
Azione5.840 |
|
DRAM | SDRAM - Mobile LPDDR | 2Gb (128M x 16) | Parallel | 208MHz | 14.4ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 60-VFBGA | 60-VFBGA (8x9) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione6.560 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione40.128 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EEPROM 128KBIT 2MHZ 8MLP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.416 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-MLP (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 10MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione32.568 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione38.880 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
Cypress Semiconductor Corp |
IC FLASH 8M PARALLEL WAFER
|
pacchetto: Die |
Azione5.952 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Wafer |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione7.872 |
|
FLASH | FLASH - NOR | 1Gb (64M x 16) | Parallel | - | 60ns | 120ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione2.928 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (32K x 16) | Parallel | - | - | 9ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
2KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.128 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
LPDDR4 96G X32 TFBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
2 MBIT, WIDE VCC (1.65V TO 3.6V)
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 2Mbit | SPI | 85 MHz | 8µs, 3ms | 6 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 32MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O | 104 MHz | 120µs, 4ms | 8 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (3x4) |
||
Micron Technology Inc. |
LPDDR5 48G 768MX64 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 48Gbit | Parallel | 4.266 GHz | - | - | - | - | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT PARALLEL 44TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 2Mbit | Parallel | - | 70ns | 70 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Azione2.820 |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O | 133 MHz | 3.5ms | 7.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |