Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEM F-RAM PARALLEL 32TSOP I
|
pacchetto: - |
Azione3.392 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.168 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
STMicroelectronics |
IC EEPROM 1KBIT 2MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.632 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | 4.5µs | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 35NS 48LCC
|
pacchetto: 48-LCC |
Azione3.392 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 48-LCC | 48-LCC (14.22x14.22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 256CABGA
|
pacchetto: 256-LBGA |
Azione3.584 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (256K x 18) | Parallel | 133MHz | - | 4.2ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 35NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.536 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 25NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.176 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.656 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
STMicroelectronics |
IC EEPROM 512KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.032 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 4ms | 450ns | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Rohm Semiconductor |
IC EEPROM 256KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.244 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP-T |
||
Cypress Semiconductor Corp |
IC FRAM 64KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione229.704 |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kb (8K x 8) | I2C | 1MHz | - | 550ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 36M PARALLEL 166MHZ
|
pacchetto: 165-TBGA |
Azione2.640 |
|
SRAM | SRAM - Synchronous | 36Mb (1M x 36) | Parallel | 166MHz | - | 3.5ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione2.032 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 512G PARALLEL 167MHZ
|
pacchetto: - |
Azione7.040 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 167MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Rohm Semiconductor |
MEMORY EEPROM
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione25.776 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.016 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
256M, 1.8V, Mobile DDR, 16Mx16,
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR | 256Mbit | Parallel | 166 MHz | 15ns | 5.5 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x10) |
||
Rohm Semiconductor |
IC EEPROM 16KBIT I2C 8TSSOP
|
pacchetto: - |
Azione9.000 |
|
EEPROM | EEPROM | 16Kbit | I2C | 400 kHz | 5ms | - | 1.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +105C), 8
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 8Gbit | Parallel | 1.2 GHz | 15ns | 18 ns | 1.14V ~ 1.26V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (10x14) |
||
Renesas Electronics Corporation |
EEPROM, 1KX8, SERIAL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ProLabs |
64GB DDR4-3200MHz Load-Reduced D
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Fairchild Semiconductor |
IC EEPROM 2KBIT I2C 8TSSOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | I2C | 400 kHz | 15ms | 900 ns | 2.7V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Renesas Electronics Corporation |
IC FLASH 4MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Azione10.683 |
|
FLASH | FLASH - NOR | 4Mbit | SPI - Quad I/O | 108 MHz | 50µs, 2.4ms | - | 2.5V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
EMMC 512G
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SRAM 4MBIT PAR 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Standard | 4Mbit | Parallel | 100 MHz | - | 8.5 ns | 3.135V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Micron Technology Inc. |
LPDDR5 96GBIT 32 315/315 LFBGA 8
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5X | 96Gbit | LVSTL | 4.266 GHz | - | - | 1.01V ~ 1.12V | -25°C ~ 85°C (TC) | Surface Mount | 315-LFBGA | 315-LFBGA (12.4x15) |
||
Infineon Technologies |
IC PSRAM 512MBIT SPI/OCTL 24FBGA
|
pacchetto: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 512Mbit | SPI - Octal I/O | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |