Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC SRAM ASYNC 44TSOP II
|
pacchetto: - |
Azione6.128 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32MBIT 108MHZ 8VDFPN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.336 |
|
FLASH | FLASH - NOR | 32Mb (8M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFPN (MLP8) (8x6) |
||
Microchip Technology |
IC FLASH 8MBIT 100MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione430.992 |
|
FLASH | FLASH | 8Mb (256 Bytes x 4096 pages) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
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Microchip Technology |
IC FLASH 8MBIT 100MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione128.940 |
|
FLASH | FLASH | 8Mb (256 Bytes x 4096 pages) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 2MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione7.168 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
ON Semiconductor |
IC EEPROM 128KBIT 400KHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione36.000 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione2.288 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.072 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione3.168 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
Microchip Technology |
IC OTP 256KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione6.256 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 90ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione3.424 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC FLASH 64MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione3.360 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 133MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.800 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 800MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.880 |
|
DRAM | SDRAM - DDR3L | 1Gb (64M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione32.400 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.408 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Micron Technology Inc. |
IC DRAM 32G 1600MHZ
|
pacchetto: - |
Azione3.440 |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gb (512M x 64) | - | 1600MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Winbond Electronics |
IC SDRAM 1GBIT 800MHZ 96BGA
|
pacchetto: - |
Azione5.232 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 32G 1866MHZ FBGA
|
pacchetto: - |
Azione5.952 |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gb (512M x 64) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione3.072 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256K PARALLEL 80TQFP
|
pacchetto: 80-LQFP |
Azione6.192 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Micron Technology Inc. |
PARALLEL/PSRAM 80M
|
pacchetto: - |
Azione4.464 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC RAM 4G PARALLEL 2GHZ
|
pacchetto: - |
Azione6.896 |
|
RAM | SGRAM - GDDR5 | 4Gb (128M x 32) | Parallel | 2GHz | - | - | 1.31 V ~ 1.65 V | 0°C ~ 95°C (TC) | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 1G PARALLEL 78FBGA
|
pacchetto: 78-VFBGA |
Azione7.020 |
|
DRAM | SDRAM - DDR3 | 1Gb (128M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x8) |
||
Winbond Electronics |
IC FLASH 256MBIT SPI 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
RLDRAM2 Memory, 288Mbit, x36, Co
|
pacchetto: - |
Request a Quote |
|
DRAM | RLDRAM 2 | 288Mbit | HSTL | 533 MHz | - | 15 ns | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-TWBGA (11x18.5) |
||
Winbond Electronics |
SPIFLASH, 3V, 64M-BIT, 4KB UNIFO
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O, QPI | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 12-UFBGA, WLCSP | 12-WLCSP |
||
Winbond Electronics |
SPIFLASH, 1.2V 64M-BIT, 4KB UNIF
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |