Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.632 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.712 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.376 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
pacchetto: 44-TQFP |
Azione6.016 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.392 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 2M LV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione12.564 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione69.072 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione5.776 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 500K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
500kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.000 |
|
400kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 300K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione69.324 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 200000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.672 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 5K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione86.388 |
|
150kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.496 |
|
128kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 1K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.256 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.548 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 64KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.008 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione118.452 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FPGA EEPROM 2M 10MHZ 44TQFP
|
pacchetto: 44-TQFP |
Azione6.624 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 512K LV 8LAP
|
pacchetto: 8-TDFN |
Azione6.300 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione7.644 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 8-LAP
|
pacchetto: 8-TDFN |
Azione31.116 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 16M GATE 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione42.852 |
|
16Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione8.964 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione4.592 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione14.940 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
AMD |
CONFIG MEMORY, 1M BITS, SERIAL
|
pacchetto: - |
Request a Quote |
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