Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Channel Type | Number of Circuits | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | Input Signal | Output Signal | Output Type | Data Rate | Operating Temperature | Features | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TRANSLATOR PECL 3.3/5V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.936 |
|
Unidirectional | 1 | 1 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR DUAL DIFF 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.976 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC XLATOR TTL-DIFF ECL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.984 |
|
Unidirectional | 1 | 1 | - | - | TTL | ECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Nexperia USA Inc. |
IC TRANSCEIVER 16BIT 3ST 56VFBGA
|
pacchetto: 56-VFBGA |
Azione6.944 |
|
Bidirectional | 2 | 8 | 0.8V ~ 3.6V | 0.8V ~ 3.6V | - | - | Tri-State, Non-Inverted | 380Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 56-VFBGA | 56-VFBGA |
||
Nexperia USA Inc. |
IC BUS TXRX TRI-STATE DUAL 8XSON
|
pacchetto: 8-XFDFN |
Azione7.936 |
|
Bidirectional | 1 | 2 | 0.8V ~ 3.6V | 0.8V ~ 3.6V | - | - | Tri-State, Non-Inverted | 500Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 8-XFDFN | 8-XSON, SOT1089 (1.35x1) |
||
Toshiba Semiconductor and Storage |
LEVEL SHIFTER 8BIT 24WCSP
|
pacchetto: 24-UFBGA, WLCSP |
Azione7.408 |
|
Bidirectional | 1 | 8 | 1.2V ~ 3.6V | 1.2V ~ 3.6V | - | - | Tri-State, Non-Inverted | 200Mbps | -40°C ~ 85°C (TA) | Auto-Direction Sensing | Surface Mount | 24-UFBGA, WLCSP | 24-WCSPC (2.05x2.05) |
||
Microchip Technology |
IC TRANSLATOR DUAL 3.3V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione2.416 |
|
Unidirectional | 1 | 2 | - | - | LVPECL | LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Texas Instruments |
IC BUS TRANSCVR 20BIT 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione15.912 |
|
Bidirectional | 2 | 10 | 1.2V ~ 3.6V | 1.2V ~ 3.6V | - | - | Tri-State, Non-Inverted | 380Mbps | -40°C ~ 85°C (TA) | - | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC V-LEVL XLATR I2C/SMBUS 8DSBGA
|
pacchetto: 8-UFBGA, DSBGA |
Azione182.028 |
|
Bidirectional | 1 | 2 | 1.2V ~ 3.3V | 1.8V ~ 5.5V | - | - | Open Drain, Push-Pull | - | -40°C ~ 85°C (TA) | Auto-Direction Sensing | Surface Mount | 8-UFBGA, DSBGA | 8-DSBGA, 8-WCSP (1.9x0.9) |
||
ON Semiconductor |
IC TRNSLTR BIDIR 8MICROPAK
|
pacchetto: 8-UFQFN |
Azione7.072 |
|
Bidirectional | 1 | 2 | 1V ~ 5.5V | 1.8V ~ 5.5V | - | - | Open Drain, Tri-State | - | -40°C ~ 85°C (TA) | Auto-Direction Sensing | Surface Mount | 8-UFQFN | 8-MicroPak™ |
||
Texas Instruments |
IC TRANSLATOR UNIDIR 14TSSOP
|
pacchetto: - |
Azione16.584 |
|
Unidirectional | 1 | 4 | 1.08 V ~ 5.5 V | 1.08 V ~ 5.5 V | - | - | Tri-State | 200Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Texas Instruments |
IC TRANSLTR BIDIRECTIONAL 6X2SON
|
pacchetto: - |
Azione27.000 |
|
Bidirectional | 1 | 1 | 1.1 V ~ 5.5 V | 1.1 V ~ 5.5 V | - | - | Non-Inverted | 420Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 6-XFDFN | 6-X2SON (1x0.8) |