Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC ISDN SUBSCRIB ACCESS 64MQFP
|
pacchetto: 64-QFP |
Azione4.352 |
|
S-Bus | - | 4.75 V ~ 5.25 V | 22mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC SLIC 2CH MTRG 44TQFP
|
pacchetto: - |
Azione60.060 |
|
2-Wire | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64LQFP
|
pacchetto: 64-LQFP |
Azione7.596 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione28.704 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
NXP |
IC C2K 900MHZ 16CH VOIP 625BGA
|
pacchetto: - |
Azione4.784 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione5.680 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC TELCOM CIRCUIT RELAY 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione73.560 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione4.384 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione4.624 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC SLIC 16CH 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione17.076 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 100-CSBGA
|
pacchetto: 100-LFBGA, CSPBGA |
Azione8.304 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Broadcom Limited |
ETH SWITCH 24FE 4X2.5G MULTILAYE
|
pacchetto: - |
Azione5.504 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC DLC/FLC LP STDBY 22-DIP
|
pacchetto: 22-DIP (0.400", 10.16mm) |
Azione5.952 |
|
- | 1 | - | 2.25mA | 1.5W | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Microchip Technology |
4P QGMII CU 3E, COM, NO SYNCE, G
|
pacchetto: - |
Azione6.592 |
|
- | - | - | - | - | - | Surface Mount | - | 138-QFN (12x12) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione7.792 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione3.888 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC TDM SWITCH 512CH FLEX 144LBGA
|
pacchetto: 144-LBGA |
Azione5.120 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.736 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione2.784 |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 512CH FLEX 144LBGA
|
pacchetto: 144-LBGA |
Azione4.752 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC TXRX DTMF 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione3.472 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Analog Devices Inc./Maxim Integrated |
IC TXRX E1 1-CHIP 5V 44-PLCC
|
pacchetto: - |
Request a Quote |
|
E1 | 1 | 4.75V ~ 5.25V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Lantiq |
WIRELESS LAN 802.11 B/G SOLUTION
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
1700 GBPS AGGREGATION SWITCH I-T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
LANTIQ PSB3427 TELECOMS IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETHERNET HGW/AP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
63137U+6302+4360X2
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
T1/E1 UNIVERSAL LINE INTERFACE
|
pacchetto: - |
Request a Quote |
|
E1, T1 | 1 | 4.75V ~ 5.25V | - | 725 mW | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |