Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC PROSLIC FXS -135V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione2.352 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Inphi Corporation |
IC ETH AGGREGATOR 4P 1369-BGA
|
pacchetto: 1369-BGA |
Azione6.768 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1369-BGA | 1369-BGA (37.5x37.5) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 1CH 52TQFP
|
pacchetto: 52-LQFP |
Azione3.600 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
Maxim Integrated |
IC LIU NRZ-CMI CONV 155M 56-QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione2.544 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (7x7) |
||
Silicon Labs |
IC SLIC/CODEC 100V LINE 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione8.028 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 110µA | 941mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione6.480 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.552 |
|
E1, J1, T1, TDM, UTOPIA II | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68-QFN
|
pacchetto: - |
Azione5.888 |
|
- | - | - | - | - | - | - | - | - |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 2CH 225BG
|
pacchetto: 225-BGA |
Azione2.800 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
pacchetto: - |
Azione263.676 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 20IO 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione88.416 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) |
||
Silicon Labs |
IC ISOMOD LINE-SIDE DAA 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione24.168 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.000 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Maxim Integrated |
IC TXRX E1 QUAD 3.3V 100LQFP
|
pacchetto: 100-LQFP |
Azione6.224 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC SIGNAL COND 8X8 69-BGA
|
pacchetto: 36-FBGA |
Azione5.472 |
|
TTL/CMOS | 8 | 2.5V, 3.3V | - | 2.65W | 0°C ~ 110°C | Surface Mount | 36-FBGA | 69-BGA |
||
Microchip Technology |
28-PORT LAYER 2 STACKABLE MANAGE
|
pacchetto: - |
Azione2.000 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET CLK OUTPUTS 256BGA
|
pacchetto: - |
Azione7.272 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.240 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48TQFP
|
pacchetto: - |
Azione2.752 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 75V 28PLCC
|
pacchetto: - |
Azione7.568 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
pacchetto: 208-LBGA |
Azione2.064 |
|
LIU | 1 | 1.6V ~ 2V | 40mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione3.424 |
|
- | 1 | 1.71V ~ 1.89V | 120mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione8.232 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Broadcom Limited |
ENTERPRISE SWITCHING
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
IC TXRX T1 1-CH 5V LP IND 44PLCC
|
pacchetto: - |
Request a Quote |
|
T1 | 1 | 4.75V ~ 5.25V | 65mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intersil |
SLIC, 2-4 CONVERSION, BIPOLAR
|
pacchetto: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 75°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |