Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SUBSCRIBER NETWRK DSIC 24DIP
|
pacchetto: - |
Azione2.672 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Through Hole | - | 24-PDIP |
||
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.664 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione6.944 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione3.680 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Maxim Integrated |
IC CTRLR HDLC CHATEAU 256-BGA
|
pacchetto: 256-BGA |
Azione3.152 |
|
Serial | 1 | 3 V ~ 3.6 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100-LQFP
|
pacchetto: 100-LQFP |
Azione3.040 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
pacchetto: 128-LQFP Exposed Pad |
Azione5.872 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x20) |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 4CH 225BG
|
pacchetto: 225-BGA |
Azione4.992 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
IDT, Integrated Device Technology Inc |
IC TXRX SGL T1/E1/J1 80TQFP
|
pacchetto: 80-LQFP |
Azione5.616 |
|
SPI | 1 | 3 V ~ 3.6 V | 1.15A | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 28I/O 64LQFP
|
pacchetto: 64-LQFP |
Azione379.188 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.008 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione47.568 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.528 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.632 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione114.708 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione170.940 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC SGL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.968 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione6.720 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
pacchetto: - |
Azione4.352 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
pacchetto: - |
Azione3.408 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
pacchetto: 324-BGA |
Azione7.360 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.320 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SLIC 1CH SWREG 63DB 44TQFP
|
pacchetto: 44-TQFP |
Azione3.632 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
pacchetto: - |
Azione5.184 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS
|
pacchetto: - |
Azione2.240 |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Infineon Technologies |
LANTIQ PSB8430 TELECOMS IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | 0°C ~ 70°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |