Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE QUAD TQFP144
|
pacchetto: 144-LQFP |
Azione6.816 |
|
E1, HDLC, J1, PCM, T1 | 4 | 3.13 V ~ 3.46 V | 330mA | 750mW | -40°C ~ 85°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Microsemi Corporation |
IC CODEC MFC 5V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.848 |
|
SSI | 1 | 4.75 V ~ 5.25 V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CESOP PROCESSOR 64CH 324BGA
|
pacchetto: 324-BGA |
Azione4.624 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Inphi Corporation |
IC ETH MAC 24-PORT 1152UBGA
|
pacchetto: 1152-BGA |
Azione5.568 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1152-BGA | 1152-UPBGA |
||
Exar Corporation |
IC LIU E1 QUAD 64TQFP
|
pacchetto: 64-LQFP |
Azione13.584 |
|
LIU | 4 | 3.14 V ~ 3.47 V, 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
NXP |
IC VOICE SWITCH SPKPHONE 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione449.844 |
|
- | 1 | 3.5 V ~ 6.5 V | 5.5mA | - | -20°C ~ 60°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione83.760 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microsemi Corporation |
IC VOICE LINE VCPNG 128CH 128TQF
|
pacchetto: 128-TQFP |
Azione4.784 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
pacchetto: - |
Azione263.520 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | - | 64-QFN |
||
Microsemi Corporation |
IC SOLAC FXS+FXO 1CH 48LQFP
|
pacchetto: - |
Azione815.928 |
|
4-Wire Serial | 2 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Intersil |
IC VDSL2 LINE DVR AMP 10HMSOP
|
pacchetto: 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione20.424 |
|
- | 2 | 4.5 V ~ 12 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HMSOP |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 128-LQFP
|
pacchetto: 128-LQFP |
Azione6.704 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Maxim Integrated |
IC LIU SDH SONET 2CH 128-LQFP
|
pacchetto: 128-LQFP Exposed Pad |
Azione6.204 |
|
CMOS | 2 | 3.15 V ~ 3.45 V | 325mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x14) |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
pacchetto: - |
Azione2.000 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
VS9806:20% OH 100G CI-BCH-4
|
pacchetto: - |
Azione5.696 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
TSE-120
|
pacchetto: - |
Azione2.800 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET PHY QUAD 138QFN
|
pacchetto: - |
Azione5.360 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 138-QFN (12x12) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione7.024 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
pacchetto: 552-BGA |
Azione6.528 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC VOICE LINE VCP 32CH 144LBGA
|
pacchetto: - |
Azione7.104 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 144-LBGA |
||
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
pacchetto: 324-FBGA |
Azione3.280 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC SLAC 4CH GCI/PCM 4IO 80LQFP
|
pacchetto: 80-LQFP |
Azione6.016 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (12x12) |
||
Infineon Technologies |
SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
S-BUS INTERFACE CIRCUIT
|
pacchetto: - |
Request a Quote |
|
S-Bus | 1 | 4.75V ~ 5.25V | 13mA | 1 W | 0°C ~ 70°C | Through Hole | 22-DIP (0.400", 10.16mm) | P-DIP-22 |
||
Infineon Technologies |
NETWORK INTERFACE CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
onsemi |
TELECOM CIRCUIT, 1-FUNC, PDSO14
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
POWER LINE COMMUNICATION MODEM,
|
pacchetto: - |
Request a Quote |
|
SPI | 1 | 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V | - | - | -40°C ~ 85°C | Surface Mount | 81-TBGA | 81-TFBGA (10x10) |