Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC MODULAR ISDN NT ORD MQFP-44
|
pacchetto: 44-QFP |
Azione4.112 |
|
ISDN | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-QFP | P-MQFP-44 |
||
Rohm Semiconductor |
IC PULSE/TONE DIALER SOP24 TR
|
pacchetto: 24-SOIC (0.209", 5.30mm Width) |
Azione29.904 |
|
- | 1 | 2.5 V ~ 5.5 V | 660µA | 550mW | -10°C ~ 60°C | Surface Mount | 24-SOIC (0.209", 5.30mm Width) | 24-SOP |
||
Silicon Labs |
IC SLIC/CODEC PROG QUAD 100TQFP
|
pacchetto: 100-TQFP Exposed Pad |
Azione3.760 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP (14x14) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione2.704 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC SLIC/CODEC 125V LINE 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione20.880 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 110µA | 941mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC BBU POWER 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.920 |
|
- | - | - | - | - | - | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
pacchetto: 484-BGA |
Azione5.552 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.584 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC MUX TEMPE T3/E3 256-BGA
|
pacchetto: 256-BGA |
Azione6.272 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Texas Instruments |
IC PROCESSOR QUAD DIF PCM 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.208 |
|
PCM, Serial | 4 | 5V | 7mA | 35mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL 100-LQFP
|
pacchetto: 100-LQFP |
Azione15.996 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 144TQFP
|
pacchetto: 144-LQFP |
Azione2.768 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacchetto: - |
Azione4.272 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione4.336 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione58.908 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.496 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
DUAL 10G (R)-XAUI PHY WITH PREMI
|
pacchetto: 196-BGA |
Azione4.672 |
|
SPI | 2 | 1V, 1.2V | - | - | -40°C ~ 110°C | Surface Mount | 196-BGA | 196-FCBGA (15x15) |
||
Microchip Technology |
IC ETHERNET QUAD PORT 256BGA
|
pacchetto: - |
Azione3.408 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione2.208 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione4.992 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione5.312 |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ECHO CANCELLER AEC 48TQFP
|
pacchetto: 48-TQFP |
Azione5.232 |
|
- | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP |
||
Broadcom Limited |
RADIAN 12MB 2X40GE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24P GE W/ GPHY AND BROADSCAN2.0
|
pacchetto: - |
Request a Quote |
|
PHY | - | - | - | - | - | - | - | - |
||
Intel |
TELECOM CIRCUIT, 1-FUNC, CMOS, P
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Texas Instruments |
TELECOM CIRCUIT, 1-FUNC, BICMOS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 75°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Renesas Electronics Corporation |
DIE SALE (PRICE IN GOOD DIE)-WAF
|
pacchetto: - |
Request a Quote |
|
SPI | 4 | - | - | - | - | Surface Mount | Die | Die |