Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC W/TRANSCEIVER MQFP-44
|
pacchetto: 44-QFP |
Azione7.888 |
|
IOM-2, SCI, UPN | 1 | 3.3V, 5V | 27mA | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Infineon Technologies |
IC NETWORK TERMINATOR MQFP44
|
pacchetto: 44-QFP |
Azione7.616 |
|
ISDN, SHDSL | 4 | 3 V ~ 6 V | 700µA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | P-MQFP-44 |
||
NXP |
IC C1K 533MHZ VOIP 448BGA
|
pacchetto: - |
Azione7.792 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione69.708 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Maxim Integrated |
IC TXRX FRONT-END 48LQFP
|
pacchetto: 48-LQFP |
Azione36.240 |
|
SPI Serial | 1 | 3 V ~ 3.6 V | 36mA, 70mA | 1.54W | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP/48-TQFP (7x7) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.256 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 24-DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione7.184 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione109.032 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Rohm Semiconductor |
IC DTMF RECEIVER SOP18 TR
|
pacchetto: 18-SOIC (0.213", 5.40mm Width) |
Azione7.536 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.2mA | 550mW | -10°C ~ 70°C | Surface Mount | 18-SOIC (0.213", 5.40mm Width) | 18-SOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
pacchetto: 28-VDFN Exposed Pad |
Azione2.096 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 128X128 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione2.928 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 48QFN
|
pacchetto: - |
Azione3.456 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione352.656 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC DUAL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.464 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC ABS VOICEPORT 2CH FXS 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione4.144 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8 FLTPK
|
pacchetto: 8-SMD, Gull Wing |
Azione124.464 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Microsemi Corporation |
IC DGTL SWITCH IDX 64X64 64MQFP
|
pacchetto: 64-BQFP |
Azione4.656 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 64-BQFP | 64-MQFP (10x10) |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.120 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL 100-LQFP
|
pacchetto: 100-LQFP |
Azione7.032 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
DUAL HDMI 1.4B RX
|
pacchetto: - |
Azione2.064 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
pacchetto: 81-LFBGA |
Azione6.816 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (9x9) |
||
Broadcom Limited |
QUAD-CHANNEL 10-GBE SFI-TO-XAUI
|
pacchetto: - |
Azione4.608 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TELECOM INTERFACE 135QFN
|
pacchetto: - |
Azione7.280 |
|
Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
pacchetto: - |
Azione5.728 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.328 |
|
- | 1 | 4.5V ~ 5.5V | 90mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Microchip Technology |
ARROW 24XFE
|
pacchetto: - |
Azione5.408 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
2CH PLC CLASS AB LINE DRIVER W R
|
pacchetto: - |
Azione25.494 |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISAC-S TE ISDN ACCESS CONTROLLER
|
pacchetto: - |
Request a Quote |
|
4-Wire, IOM-2 | 1 | 4.75V ~ 5.25V | 17mA | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64-1 |