Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC LINE DRIVER 2CH ADSL+ 24QFN
|
pacchetto: 24-VQFN Exposed Pad |
Azione34.080 |
|
- | 2 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 24-VQFN Exposed Pad | 24-QFN (6x6) |
||
Maxim Integrated |
IC DS21448 REV A1 COMM TEBGA
|
pacchetto: 144-BGA |
Azione6.976 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione4.800 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione2.736 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC SLIC PROG 1-CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione4.480 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.520 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC CONTROLLER E1 5V LP 40-DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione7.696 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione26.208 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 16CH SH 484BGA
|
pacchetto: 484-LFBGA |
Azione4.720 |
|
E1, J1, T1 | 16 | 1.8V, 3.3V | - | 3.10W | -40°C ~ 85°C | Surface Mount | 484-LFBGA | 484-CABGA (19x19) |
||
NXP |
IC C2K 1.2GHZ 16CH VOIP 625BGA
|
pacchetto: - |
Azione7.536 |
|
- | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC RECEIVER DTMF CMOS 18MFP
|
pacchetto: - |
Azione5.296 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Solutions Sdn Bhd. |
1-PORT 10/100/1000 BASE-T PHY (G
|
pacchetto: - |
Azione8.676 |
|
Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
||
Microsemi Corporation |
ARROW M8XFE
|
pacchetto: - |
Azione7.888 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione2.704 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
16GE + 10GE SWITCH
|
pacchetto: - |
Azione2.288 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 535BGA
|
pacchetto: 535-BGA |
Azione5.184 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Microchip Technology |
IC TDM SWITCH 1024X1024 256BGA
|
pacchetto: 256-BGA |
Azione7.440 |
|
- | 1 | 1.71V ~ 1.89V | 75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 208LBGA
|
pacchetto: 208-LBGA |
Azione7.104 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC PCM/SPI-ZSI BUS XLATOR 16SOIC
|
pacchetto: - |
Azione6.656 |
|
SPI | 1 | 3.3V | 10mA | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
IC VOICE LINE VCP2 64CH 128TQFP
|
pacchetto: 128-TQFP |
Azione5.136 |
|
PCM | 1 | 3.3V | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Broadcom Limited |
VDSL 24-LINE 17A DSP
|
pacchetto: - |
Request a Quote |
|
DSP | 24 | - | - | - | - | - | - | - |
||
Harris Corporation |
RINGING SLIC FAMILY
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -16V ~ -100V, 4.75V ~ 5.25V | 5mA | 310 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
FRAMER E1/T1 5V
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISDN EXCHANGE POWER CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | Surface Mount | 28-LCC (J-Lead) | PG-LCC-28-R |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BCM63138DSAR00
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
PCM INTERFACE CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |