Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CTRLR INT 256CH 323-FCLBGA
|
pacchetto: 323-BBGA, FCBGA |
Azione4.544 |
|
E1, HDLC, PPP, Serial, T1, TMA | - | - | - | 2W | -40°C ~ 85°C | Surface Mount | 323-BBGA, FCBGA | 323-FCLBGA |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 208LBGA
|
pacchetto: 208-LBGA |
Azione6.352 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Cirrus Logic Inc. |
IC LIU T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.080 |
|
E1, T1 | 1 | 4.75 V ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176TQFP
|
pacchetto: 176-LQFP |
Azione2.768 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 8+1CH 416BGA
|
pacchetto: 416-BGA |
Azione4.784 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 416-BGA | 416-PBGA (27x27) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II SNGL 100LBGA
|
pacchetto: 100-LBGA |
Azione6.384 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Cypress Semiconductor Corp |
IC RECLOCKER HOTLINK II 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione5.952 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 100-LBGA
|
pacchetto: 100-LBGA |
Azione14.088 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Maxim Integrated |
IC FRAMER ENHANCED E1 4X 128TQFP
|
pacchetto: 128-LQFP |
Azione2.208 |
|
Parallel/Serial | 4 | 2.97 V ~ 3.63 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.504 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC TXRX QUAD T1/E1/J1 SCT 256BGA
|
pacchetto: 256-BGA |
Azione4.480 |
|
E1, J1, T1 | 4 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione4.912 |
|
- | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione11.916 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 8K CH 196BGA
|
pacchetto: 256-BGA |
Azione2.240 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA |
||
Silicon Labs |
IC PROSLIC FXS ISI DTMF 48QFN
|
pacchetto: - |
Azione7.344 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Microsemi Corporation |
IC 1FXO CHIPSET 1CH OLAC 48LQFP
|
pacchetto: - |
Azione2.752 |
|
- | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione29.184 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.624 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione7.984 |
|
- | 1 | 1.71V ~ 1.89V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 100V 16SOIC
|
pacchetto: - |
Azione4.944 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
PB FREE T1/E1 SYSTEM SYNCHRONIZE
|
pacchetto: - |
Azione20.736 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione27.876 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
CML Microcircuits |
IC TELECOM INTERFACE 16SOIC
|
pacchetto: - |
Azione69 |
|
- | - | - | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Broadcom Limited |
63168V+6302+53124S VDSL IAD CH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
EIA/ITU 24V PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -20V ~ -28V, 4.75V ~ 5.25V | - | 60 mW | 0°C ~ 75°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Broadcom Limited |
BCM63167S0001
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
OPT TRANSPORT PROCESSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |