Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC INCA-IP2 PHONE 324-LBGA
|
pacchetto: 324-LBGA |
Azione7.648 |
|
PCM, SPI | 1 | - | - | - | - | Surface Mount | 324-LBGA | PG-LBGA-324-3 |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PLCC-28
|
pacchetto: 28-LCC (J-Lead) |
Azione4.544 |
|
- | 1 | 5V | 2.8mA | 290mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | P/PG-LCC-28 |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.272 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Cypress Semiconductor Corp |
IC DESERIAL HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione5.184 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione15.276 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.872 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC FRAMER T1 28-CHANNEL IND
|
pacchetto: 316-BGA |
Azione2.096 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 316-BGA | - |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-LQFP
|
pacchetto: 100-LQFP |
Azione7.056 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione3.168 |
|
- | 1 | 1.71 V ~ 1.89 V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
pacchetto: 144-LQFP |
Azione5.056 |
|
Parallel/Serial | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 4KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione2.480 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 20I/O 44TQFP
|
pacchetto: 44-TQFP |
Azione57.084 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 40QFN
|
pacchetto: - |
Azione7.872 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC TXRX DTMF 3V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.624 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.184 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IXYS Integrated Circuits Division |
IC LITELINK III HALF RING 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione18.372 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.984 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
MODULE SONET/SDH
|
pacchetto: - |
Azione6.176 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH DHS 100MQFP
|
pacchetto: 100-BQFP |
Azione6.816 |
|
Parallel | 1 | 4.75V ~ 5.25V | 100mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microchip Technology |
IC CODEC A-LAW PCM 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione6.160 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC ABS VOICEPORT 2CH FXS 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione5.872 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microchip Technology |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
pacchetto: 24-QFN |
Azione3.264 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
||
Analog Devices Inc./Maxim Integrated |
IC TXRX E1 1-CHIP 5V IND 44-PLCC
|
pacchetto: - |
Request a Quote |
|
E1 | 1 | 4.8V ~ 5.25V | 65mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Harris Corporation |
5 REN RINGING SLIC FOR ISDN
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -16V ~ -80V, 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 75°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
SMSC |
USRT UNIVERSAL SYNCHRONOUS RECEI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
LINE CARD, 25G CONNECTIVITY
|
pacchetto: - |
Request a Quote |
|
PCI | 1 | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MILLI A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |