Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
pacchetto: 425-FBGA |
Azione3.776 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
Texas Instruments |
IC MPU OMAP-L1X 456MHZ 361NFBGA
|
pacchetto: 361-LFBGA |
Azione4.000 |
|
1 Core, 32-Bit | 456MHz | Signal Processing; C674x, System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | SATA 3Gbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | -40°C ~ 90°C (TJ) | Boot Security, Cryptography | 361-LFBGA | 361-NFBGA (13x13) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione6.368 |
|
1 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 90°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione3.968 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 668BGA
|
pacchetto: 668-BBGA Exposed Pad |
Azione6.896 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione6.864 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione4.400 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
pacchetto: 784-BBGA, FCBGA |
Azione4.496 |
|
1 Core, 32-Bit | 667MHz | Communications; CPM | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione2.912 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione3.824 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU M683XX 33MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione5.520 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione6.336 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione5.696 |
|
1 Core, 32-Bit | 1.25GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
pacchetto: 783-BFBGA, FCBGA |
Azione2.560 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BFBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.608 |
|
2 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX6UL 289BGA
|
pacchetto: - |
Azione7.008 |
|
1 Core, 32-Bit | 696MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | - |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione3.504 |
|
2 Core, 32-Bit | 1.2GHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
|
pacchetto: - |
Azione7.952 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6SX ROM PERF ENHAN
|
pacchetto: 400-LFBGA |
Azione2.816 |
|
2 Core, 32-Bit | 200MHz, 1GHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | 400-LFBGA | 400-MAPBGA (17x17) |
||
Texas Instruments |
SN278792960
|
pacchetto: - |
Azione6.624 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
pacchetto: 516-BBGA Exposed Pad |
Azione2.100 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU QORIQ T4 1.3GHZ 1932BGA
|
pacchetto: - |
Request a Quote |
|
24 Core, 64-Bit | 1.3GHz | - | DDR3, DDR3L | No | - | 1Gbps (13), 10Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.8V, 2.5V | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 1932-BBGA, FCBGA | 1932-FCPBGA (45x45) |
||
STMicroelectronics |
IC MPU STM32MP1 800MHZ 361TFBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 209MHz, 800MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ | 361-TFBGA | 361-TFBGA (12x12) |
||
Intel |
INTEL PENTIUM 4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Advanced Micro Devices |
IC MPU 25MHZ 145PGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 25MHz | - | - | Yes | - | - | - | - | 5V | 0°C ~ 85°C (TC) | - | 145-PGA | 145-PGA |
||
NXP |
IC MPU QORIQ 1.5GHZ 448FBGA
|
pacchetto: - |
Request a Quote |
|
2 Core, 64-Bit | 1.5GHz | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | -40°C ~ 105°C (TA) | Secure Boot, TrustZone® | 448-BFBGA | 448-FBGA (17x17) |
||
Nuvoton Technology Corporation |
IC MPU 300MHZ 64LQFP
|
pacchetto: - |
Azione534 |
|
1 Core, 32-Bit | 300MHz | - | DDR, DDR2, LPDDR2 | Yes | LCD | 10/100Mbps (2) | - | USB 2.0 (3) | 3.3V | -40°C ~ 85°C (TA) | AES, ECC, SHA, TRNG | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
MaxLinear, Inc. |
IC MPU 484FCBGA
|
pacchetto: - |
Request a Quote |
|
1 Core | - | - | - | No | H.264 AVC/SVC, MJPEG, MPEG-4 | - | - | - | - | - | - | 484-BGA, FCBGA | 484-FCBGA |