Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC PROCESSOR DUAL CORE
|
pacchetto: 448-FBGA Exposed Pad |
Azione4.384 |
|
1 Core, 32-Bit | 650MHz | - | DDR2 | No | - | GbE (2) | - | USB 2.0 + PHY (1) | - | -40°C ~ 85°C (TA) | - | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) |
||
NXP |
IC MPU MPC83XX 266MHZ 369BGA
|
pacchetto: 369-LFBGA |
Azione7.184 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 3.3V | 0°C ~ 105°C (TA) | - | 369-LFBGA | 369-PBGA (19x19) |
||
NXP |
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
|
pacchetto: 1023-BCBGA, FCCBGA |
Azione5.648 |
|
2 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
|
pacchetto: 1023-BCBGA, FCCBGA |
Azione3.808 |
|
2 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione3.936 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (4) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 350MHZ 256BGA
|
pacchetto: 256-LBGA |
Azione7.920 |
|
1 Core, 32-Bit | 350MHz | - | DDR | No | - | 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS-I 33MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.160 |
|
1 Core, 32-Bit | 33MHz | System Control; CP0 | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 85°C (TC) | - | 100-LQFP | 100-TQFP (14x14) |
||
NXP |
IC MPU MPC83XX 400MHZ 740TBGA
|
pacchetto: 740-LBGA |
Azione5.392 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
pacchetto: 256-BGA |
Azione43.344 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione3.232 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU M683XX 20MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione7.168 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
IC MPU M683XX 33MHZ 240FQFP
|
pacchetto: 240-BFQFP |
Azione4.528 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 240-BFQFP | 240-FQFP (32x32) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
pacchetto: 784-BBGA, FCBGA |
Azione5.936 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1), 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 780FCBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione6.480 |
|
4 Core, 32-Bit | 1.2GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 780-BBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione5.136 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC83XX 400MHZ 516BGA
|
pacchetto: 516-BBGA Exposed Pad |
Azione3.840 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
Intel |
IC MPU STRONGARM 232MHZ 520BGA
|
pacchetto: 520-LFBGA |
Azione7.680 |
|
1 Core, 32-Bit | 232MHz | Data; Microengine | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 520-LFBGA | 520-HL-PBGA (40x40) |
||
NXP |
IC MPU MPC82XX 450MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione6.304 |
|
1 Core, 32-Bit | 450MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
Zilog |
IC MPU Z180 6MHZ 80QFP
|
pacchetto: 80-BQFP |
Azione6.160 |
|
1 Core, 8-Bit | 6MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 80-BQFP | 80-QFP |
||
Advantech Corp |
XEON 2.1G 16.5M 3647P 12C 4116 7
|
pacchetto: - |
Azione4.976 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MXRT1050 A1
|
pacchetto: 196-LFBGA |
Azione15.264 |
|
1 Core, 32-Bit | 528MHz | - | SDRAM | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | -40°C ~ 105°C (TJ) | BEE, DCP, HAB, SJC, SNVS, TRNG | 196-LFBGA | 196-MAPBGA (10x10) |
||
STMicroelectronics |
MPU WITH ARM DUAL CORTEX-A7 650
|
pacchetto: - |
Azione6.192 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
MPU WITH ARM CORTEX-A7 650 MHZ,
|
pacchetto: - |
Azione7.680 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
|
pacchetto: - |
Request a Quote |
|
4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1.3GHz | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | 2.5Gbps (3) | - | USB 2.0 OTG (1) | 1.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
Renesas Electronics Corporation |
GRAPHICS PROCESSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC MPU RZ/T2M 600/800MHZ 225FBGA
|
pacchetto: - |
Azione324 |
|
2 Core, 32-Bit | 600MHz, 800MHz | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | -40°C ~ 125°C (TJ) | - | 225-LFBGA | 225-FBGA (13x13) |
||
Renesas Electronics Corporation |
IC MPU RZ 200MHZ/1.2GHZ 361BGA
|
pacchetto: - |
Azione288 |
|
3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31 | DDR3L, DDR4 | No | MIPI/CSI, MIPI/DSI | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | 361-LFBGA | 361-BGA (13x13) |
||
NXP |
IC MPU QORLQ 1.8GHZ 1517FCPBGA
|
pacchetto: - |
Request a Quote |
|
12 Core, 64-Bit | 1.8GHz | - | DDR4 | Yes | - | 100Gbps (2) | SATA 3.0 (4) | USB 3.0 (2) + PHY (2) | 1.2V, 1.8V, 3.3V | 0°C ~ 105°C (TJ) | Secure Boot, TrustZone® | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) |