Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:4 350MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.448 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | LVPECL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 40VFQFPN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione3.584 |
|
1 | 1:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione7.488 |
|
1 | 1:5 | Yes/No | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.984 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.160 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 2:5 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.120 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione66.024 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.192 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione18.600 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:6 7.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione15.120 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | CML | 7.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 2GHZ 40QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.072 |
|
2 | 1:6 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.512 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.384 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC CLK BUFFER 2:5 200MHZ 24WQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione2.160 |
|
1 | 2:5 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, SSTL, Crystal | LVCMOS | 200MHz | 2.375 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-WQFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.912 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.944 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8COIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.672 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.1 V ~ 1.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione21.984 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Diodes Incorporated |
CLOCKBUFFERV-QFN4040-24
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.328 |
|
1 | 1:1 | No/Yes | CMOS | HCSL | 125MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-TQFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLEXER 48LQFP
|
pacchetto: 48-LQFP |
Azione2.000 |
|
12 | 12:2 | Yes/Yes | LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 2.625 V, 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.480 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Microchip Technology |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.360 |
|
1 | 4:10 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:18 2GHZ 48VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:18 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS, LVPECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: - |
Azione873 |
|
1 | 1:4 | No/No | LVTTL | LVCMOS, LVTTL | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 2GHZ 16VFQFPN
|
pacchetto: - |
Azione7.500 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:2 200MHZ 8VFQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 3:11 2GHZ
|
pacchetto: - |
Request a Quote |
|
1 | 3:11 | Yes/Yes | HCSL, HSTL, LVDS, LVPECL, Crystal | HCSL, LVDS, LVPECL | 2 GHz | 2.375V ~ 3.465V | -40°C ~ 85°C | - | - | - |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:8 100MHZ 40QFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | HCSL | HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |